SPC582B60E3

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32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

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Product overview

Description

The SPC582Bx microcontroller is the entry member of a new family of devices superseding the SPC560Bx family.

SPC582Bx is built on the legacy of the SPC5x products, while introducing new features to answer the future requirements like the ASIL-B classification, high number of ISO CAN-FD channels, and provide significant power and performance improvement (MIPS per mW).

  • All features

    • AEC-Q100 qualified
    • High performance e200z2 single core
      • 32-bit power architecture technology CPU
      • Core frequency as high as 80 MHz
      • Variable length encoding (VLE)
      • Floating point, End-to-End error correction
    • 1088 KB (1024 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • 96 KB on-chip general-purpose SRAM
    • Multi-channel direct memory access controller (eDMA) with 16 channels
    • 1 interrupt controller (INTC)
    • Comprehensive new generation ASIL-B safety concept
      • ASIL-B of ISO 26262
      • FCCU for collection and reaction to failure notifications
      • Memory error management Unit (MEMU) for collection and reporting of error events in memories
      • Cyclic redundancy check (CRC) unit
      • End-to-end error correction code (e2eECC) logic
    • Crossbar switch architecture for concurrent access to peripherals, flash, or RAM from multiple bus masters with end-to-end ECC
    • Body cross triggering unit (BCTU)
      • Triggers ADC conversions from any eMIOS channel
      • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
      • 1 event configuration register dedicated to each timer event allows to define the corresponding ADC channel
      • Synchronization with ADC to avoid collision
    • 1 enhanced 12-bit SAR analog-to-digital converters
      • Up to 27 channels
      • enhanced diagnosis feature
    • Communication interfaces
      • 6 LINFlexD modules
      • 4 deserial serial peripheral interface (DSPI) modules
      • 7 MCAN interfaces with advanced shared memory scheme and ISO CAN FD support
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus Class 3 debug and trace interface
    • Boot assist flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART.
    • Enhanced modular IO subsystem (eMIOS): up to 32 timed I/O channels with 16-bit counter resolution
    • Advanced and flexible supply scheme
      • On-chip voltage regulator for 1.2 V core logic supply.
    • Junction temperature range -40 °C to 150 °C

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STMicroelectronics - SPC582B60E3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SPC582B60E3CD00X
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2
SPC582B60E3MH00X
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2
SPC582B60E3MH00Y
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2

SPC582B60E3CD00X

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

SPC582B60E3MH00X

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

SPC582B60E3MH00Y

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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SPC582B60E3MH00Y
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SPC582B60E3CD00X
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SPC582B60E3MH00Y Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC582B60E3MH00Y

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

80

Features set:

-

Flash Size (kB) (Data):

64

SPC582B60E3MH00X Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC582B60E3MH00X

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

80

Features set:

-

Flash Size (kB) (Data):

64

SPC582B60E3CD00X Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC582B60E3CD00X

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

80

Features set:

-

Flash Size (kB) (Data):

64

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors