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32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

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Product overview

  • All features

    • AEC-Q100 qualified
    • High performance e200z4 triple core:
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 180 MHz
      • Variable Length Encoding (VLE)
      • Floating Point, End-to-End Error Correction
    • 6582 KB (6144 KB code flash+ 256 KB data flash) on-chip flash memory:
      • supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
      • Supports read while read between the two code Flash partitions.
    • 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM): 64KB in CPU_0, 64 KB in CPU_1 and 32 KB in CPU_2
    • 182 KB HSM dedicated flash memory (144 KB code + 32 KB data)
    • Multi-channel direct memory access controller (eDMA)
      • one eDMA with 64 channels
      • one eDMA with 32 channels
    • 1 interrupt controller (INTC)
    • Comprehensive new generation ASIL-D safety concept:
      • ASIL-D of ISO 26262
      • One CPU channel in lockstep
      • Logic BIST
      • FCCU for collection and reaction to failure notifications
      • Memory BIST
      • Cyclic redundancy check (CRC) unit
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
    • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
    • Body cross triggering unit (BCTU)
      • Triggers ADC conversions from any eMIOS channel
      • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
    • Enhanced modular IO subsystem (eMIOS): up to 64 timed IO channels with 16-bit counter resolution
    • Enhanced analog-to-digital converter system with:
      • 4 independent fast 12-bit SAR analog converters
      • One supervisor 12-bit SAR analog converter
      • One standby 10-bit SAR analog converter
    • Communication interfaces:
      • 18 LINFlexD modules
      • 10 deserial serial peripheral interface (DSPI) modules
      • 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
      • Dual-channel FlexRay controller
      • Two independent Ethernet controllers 10/100Mbps compliant IEEE 802.3-2008
    • Low power capabilities
      • Versatile low power modes
      • Ultra low power standby with RTC
      • Smart Wake-up Unit for contact monitoring
      • Fast wakeup schemes
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard
    • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
    • Junction temperature range -40 °C to 150 °C

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STMicroelectronics - SPC58NG80E5

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
TQFP 144 20x20x1.0 Automotive Safety Ecopack2



TQFP 144 20x20x1.0

Material Declaration**:


Marketing Status



TQFP 144 20x20x1.0


Automotive Safety

RoHS Compliance Grade


(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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