Product overview
Description
STM32Cube is an STMicroelectronics original initiative to make the life of the developer easier by reducing development effort, time, and cost. STM32Cube covers the whole STM32 portfolio.
STM32Cube includes STM32CubeMX, a graphical software configuration tool that allows the generation of C initialization code using graphical wizards.
It also comprises the STM32CubeWBA MCU Package, composed of the STM32Cube hardware abstraction layer (HAL) and the low-layer (LL) APIs, a consistent set of middleware components such as STMTouch™, STM32_WPAN (Bluetooth® 5.3 profiles and services), Azure® RTOS kernel, OpenBootloader, mbedTLS, TFM, MCUboot, and HCI connectivity services. All embedded software utilities are delivered with a full set of examples running on STMicroelectronics boards.
The STM32Cube HAL is an STM32 embedded software layer that ensures maximized portability across the STM32 portfolio, while the LL APIs make up a fast, light-weight, expert-oriented layer, which is closer to the hardware than the HAL. HAL and LL APIs can be used simultaneously with a few restrictions.
Both the HAL and LL APIs are production-ready and have been developed in compliance with CodeSonar®, MISRA C®:2012 guidelines and ISO/TS 16949. Furthermore, STMicroelectronics specific validation processes add a deeper-level qualification.
The STM32CubeWBA gathers in one single package all generic embedded software components required to develop an application on STM32WBA series microcontrollers. Following STM32Cube initiative, this set of components is highly portable, not only within the STM32WBA series, but also to other STM32 series. In addition, the low-layer APIs provide an alternative, high-performance, low-footprint solution to the STM32CubeWBA HAL at the cost of portability and simplicity.
HAL and LL APIs are available in open-source BSD license for user convenience.
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All features
- Consistent and complete embedded software offer that frees the user from dependency issues
- Maximized portability between all STM32 series supported by STM32Cube
- Hundreds of examples for easy understanding
- High quality HAL using CodeSonar® static analysis tool
- High quality low-layer APIs (LL) using CodeSonar® static analysis tool
- STM32WBA series middleware: STMTouch™(STM32 touch sensing library) and Azure® RTOS kernel, OpenBootloader, mbedTLS, TFM, MCUboot
- STM32WBA-specific middleware: STM32_WPAN, including Bluetooth® Low Energy 5.3 profiles, services and stack, certified with Bluetooth® SIG
- Free user-friendly license terms. Update mechanism with new-release notification capability
- Published on GitHub in addition to www.st.com to propagate bug fixes and improvements faster, open for pull requests and issues to facilitate user contributions and direct feedback
Get Software
| Part Number | General Description | ECCN (EU) | ECCN (US) | Supplier | Latest version | Download |
|---|---|---|---|---|---|---|
| STM32CubeWBA | STM32Cube MCU Package for STM32WBA series | NEC | 5D992.c | ST | 1.0.0 | x License AgreementACCEPTPlease indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
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All resources
| Resource title | Version | Latest update |
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Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 06 Mar 2023 | 06 Mar 2023 |
Application Notes (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Mar 2023 | 13 Mar 2023 | ||
| 1.0 | 06 Mar 2023 | 06 Mar 2023 |
User Manuals (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 28 Mar 2023 | 28 Mar 2023 | ||
| 3.0 | 28 Oct 2019 | 28 Oct 2019 | ||
| 1.0 | 02 Feb 2023 | 02 Feb 2023 | ||
| 2.0 | 10 Jul 2019 | 10 Jul 2019 | ||
| 1.0 | 21 Mar 2023 | 21 Mar 2023 |
Presentations (5 of 6)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 22.08 | 10 Aug 2022 | 10 Aug 2022 | ||
| 2.5 | 13 Jan 2016 | 13 Jan 2016 | ||
| 22.08 | 10 Aug 2022 | 10 Aug 2022 | ||
| 23.3 | 07 Mar 2023 | 07 Mar 2023 | ||
| 22.08 | 10 Aug 2022 | 10 Aug 2022 | ||
| 23.03 | 08 Mar 2023 | 08 Mar 2023 |
Flyers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 23.1 | 13 Mar 2023 | 13 Mar 2023 |
Brochures (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 20.07 | 29 Jul 2020 | 29 Jul 2020 |
License Agreement (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.30 | 09 Mar 2023 | 09 Mar 2023 |
Additional License Terms (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| HTML | 1.0.0 | 16 Feb 2023 | 16 Feb 2023 |