STREF-MKI128V6

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Design Win

Smart MEMS Multi-sensor module

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Product overview

Description

The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).

  • All features

    • The board integrates:
      • iNEMO inertial module LSM6DSM
      • Magnetometer LIS2MDL
      • Pressor sensor LPS22HB
    • Relative Humidity and temperature sensor HTS221
    • WEEE compliant
    • RoHS compliant

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade WEEE Compliant Material Declaration**
STREF-MKI128V6
Active
CARD Industrial - -

STREF-MKI128V6

Package:

CARD

Material Declaration**:

Marketing Status

Active

Package

CARD

Grade

Industrial

RoHS Compliance Grade

-

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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STREF-MKI128V6
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STREF-MKI128V6 Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STREF-MKI128V6

Supplier:

ST

Core Product:

LSM6DSM, LIS2MDL, LPS22HB, HTS221

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors