Ultra low power 3-axis accelerometer, SPI/I2C digital output MEMS motion sensor

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  • The H3LIS100DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

    The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
    The H3LIS100DL has a full scale of ±100 g and is capable of measuring accelerations with output data rates from 0.5 Hz to 400 Hz.
    The H3LIS100DL is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    Key Features

    • Wide supply voltage, 2.16 V to 3.6 V
    • Low-voltage compatible IOs, 1.8 V
    • Ultra-low power consumption down to 10 μA in low-power mode
    • ±100 g full scale
    • I2C/SPI digital output interface
    • 8-bit data output
    • Sleep-to-wakeup function
    • 10000 g high shock survivability
    • ECOPACK®, RoHS and “Green” compliant

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Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
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H3LIS100DL LLGA 16 3x3x1.0 Tray
Active
3 1000 EAR99 - No availability of distributors reported, please contact our sales office
H3LIS100DLTR LLGA 16 3x3x1.0 Tape And Reel
Active
3 1000 EAR99 - Check Availability

Distributor availability ofH3LIS100DLTR

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 7743 1 Order Now
RS COMPONENTS EUROPE 4026 1 Order Now
MOUSER WORLDWIDE 11317 1 Order Now
Farnell Element14 EUROPE 2702 1 Order Now

Distributor reported inventory date: 2019-04-23

Distributor Name

DIGIKEY

Stock

7743

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

4026

Min.Order

1

Region

EUROPE Order Now

MOUSER

Stock

11317

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

2702

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-04-23

Get sample

H3LIS100DL

Package

LLGA 16 3x3x1.0

Packing Type

Tray

Unit Price (US$)

3.0*

Marketing Status

Active

Unit Price (US$)

3

Quantity

1000

ECCN (US)

EAR99

Country of Origin

-

H3LIS100DLTR

Package

LLGA 16 3x3x1.0

Packing Type

Tape And Reel

Unit Price (US$)

3.0*

Distributor availability ofH3LIS100DLTR

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 7743 1 Order Now
RS COMPONENTS EUROPE 4026 1 Order Now
MOUSER WORLDWIDE 11317 1 Order Now
Farnell Element14 EUROPE 2702 1 Order Now

Distributor reported inventory date: 2019-04-23

Distributor Name

DIGIKEY

Stock

7743

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

4026

Min.Order

1

Region

EUROPE Order Now

MOUSER

Stock

11317

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

2702

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-04-23

Marketing Status

Active

Unit Price (US$)

3

Quantity

1000

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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Embedded Software

    • Part Number

      Android sensor HAL for MEMS motion and environmental sensors (Input framework)

      Linux device drivers for MEMS motion and environmental sensors (Input framework)

Evaluation Tools

    • Part Number

      H3LIS100DL adapter board for a standard DIL 24 socket

Support and Applications

    • Part Number

      Complete hardware and firmware design for all applications

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS10883
      MEMS motion sensor: low-power high-g 3-axis digital accelerometer
      2.0
      659.99 KB
      PDF
      DS10883

      MEMS motion sensor: low-power high-g 3-axis digital accelerometer

    • Description Version Size Action
      TN0018
      Surface mounting guidelines for MEMS sensors in an LGA package
      6.0
      214.31 KB
      PDF
      TN0018

      Surface mounting guidelines for MEMS sensors in an LGA package

    • Description Version Size Action
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0053
      6-point tumble sensor calibration
      1.0
      464.9 KB
      PDF
      DT0126
      Low-power application design with ST's MEMS accelerometers
      1.0
      184.68 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0127
      ST's MEMS accelerometer sensor testing & self-test
      1.1
      409.32 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0053

      6-point tumble sensor calibration

      DT0126

      Low-power application design with ST's MEMS accelerometers

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

      DT0127

      ST's MEMS accelerometer sensor testing & self-test

Publications and Collaterals

    • Description Version Size Action
      Industrial MEMS motion sensors 1.0
      1.36 MB
      PDF

      Industrial MEMS motion sensors

    • Description Version Size Action
      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience 1.0
      1.91 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF
      Sensors for industrial and multi-segment solutions 1.0
      1.77 MB
      PDF

      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience

      Sensor & motion algorithm software pack for STM32Cube

      Sensors for industrial and multi-segment solutions

    • Description Version Size Action
      Capacitive MEMS accelerometer for condition monitoring 1.0
      3.35 MB
      PDF

      Capacitive MEMS accelerometer for condition monitoring

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
H3LIS100DL
Active
LLGA 16 3x3x1.0 Ecopack2
H3LIS100DLTR
Active
LLGA 16 3x3x1.0 Ecopack2

H3LIS100DL

Package:

LLGA 16 3x3x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

H3LIS100DLTR

Package:

LLGA 16 3x3x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.