Product overview
Description
The IIS3DWB10IS is a system-in-package featuring a 3-axis digital vibration sensor with low noise over an ultrawide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, along with the capability of operating over an extended temperature range (up to +125°C) and up to ±200 g acceleration full scale, make the device particularly suitable for vibration monitoring in any industrial application, including those in the harshest and most demanding environments.
The IIS3DWB10IS has a selectable full-scale acceleration range of ±50 / ±100 / ±200 g and is capable of measuring accelerations with a bandwidth above 10 kHz. A 2048-slot first-in, first-out (FIFO) buffer is integrated in the device to batch data from the integrated accelerometer, temperature sensor, or ISPU as well as to avoid any data loss and to limit intervention from the host processor.
The IIS3DWB10IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultralow-power, high-performance programmable core that can execute real-time signal processing and edge AI algorithms. The ISPU can be programmed in C code and can rely on an ecosystem with libraries and tools/IDE from ST and 3rd party.
Its optimized ultralow-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node for Industry 5.0.
The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial, and consumer markets. The sensing elements are manufactured using ST’s proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology.
The IIS3DWB10IS has a self-test capability, which allows checking the functioning of the sensor in the final application. The IIS3DWB10IS is available in a 16-lead plastic, land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40°C to +125°C.
-
All features
- 3-axis vibration sensor with digital output
- User-selectable full scale: ±50 / ±100 / ±200 g
- Ultrawide and flat frequency response range: from DC to above 10 kHz (±3 dB point)
- Equalization and filtering guarantee a flat and alias-free frequency response
- Ultralow noise density: down to 35 µg/√Hz
- Embedded ISPU (intelligent sensor processing unit): ultralow-power, high-performance programmable core to execute real-time signal processing and edge AI algorithms
- High stability of the sensitivity over temperature and against mechanical shocks
- Supports accurate external clock input in order to enable precise synchronization of an array of sensors and to improve ODR stability
- Extended temperature range from -40 to +125°C
- Multiple operating modes
- Continuous mode (CM)
40 / 80 kHz ODR @ >10 kHz bandwidth 2.5 / 5 / 10 / 20 kHz ODR @ ODR/2 bandwidth - Burst mode (BM)
Configurable burst of acquisitions in CM mode triggered by the ISPU, FIFO, internal timer, or external conditions
- Continuous mode (CM)
- Low power: 1.9 mA with one axis active, 4.1 mA with all three axes active
- SPI serial interface / MIPI I3C® serial interface
- Embedded FIFO: 2048 slots with configurable batching for accelerometer, temperature sensor, and ISPU data
- Embedded temperature sensor
- Embedded self-test
- Supply voltage: 1.7 V to 3.6 V
- Compact package: LGA 4.5 x 4.5 x 1.5 mm 16-lead with wettable flanks
- ECOPACK and RoHS compliant
EDA Symbols, Footprints and 3D Models
STMicroelectronics - IIS3DWB10IS
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|
| IIS3DWB10ISTR | Active Product is in volume production. | LLGA 4.5 X 4.5 X 1.5 MM MAX 16L | Ecopack2 | 10 | 2023-01-01T00:00:00.000+01:00 | |
IIS3DWB10ISTR
Package:
LLGA 4.5 X 4.5 X 1.5 MM MAX 16LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
You’re now leaving st.com and will be re-directed to our Partner’s website.
For the latest innovations and solutions from ST, sign up for our newsletters.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| IIS3DWB10ISTR | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
IIS3DWB10ISTR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors