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6-axis IMU (inertial measurement unit) with wide bandwidth, low-noise accelerometer, embedded AI and sensor fusion for industrial applications

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Product overview


The ISM330BX is a system-in-package inertial measurement unit (IMU) featuring a 3‑axis digital accelerometer and a 3-axis digital gyroscope with triple channels for processing acceleration and angular rate data for motion tracking and vibration measurements along with Qvar sensing on up to three separate channels with dedicated configuration, processing, and filtering.

The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.

The ISM330BX embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), adaptive self-configuration (ASC), and machine learning core (MLC) with exportable AI features/filters for IoT applications.

The ISM330BX integrates a 6-axis IMU sensor in a compact package (2.5 x 3.0 x 0.71 mm).

  • All features

    • 3-axis accelerometer with selectable full scale: ±2/±4/±8 g
    • 3-axis gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
    • 3-axis accelerometer with flat, wide bandwidth (2 kHz) frequency response and low noise (70 μg/√Hz over the SPI/I²C/I3C interface and even down to 30 μg/√Hz over the TDM interface)
    • Low supply current in high-performance mode: 0.6 mA in combo mode; 0.19 mA accelerometer only
    • SPI / I²C / MIPI I3C® v1.1 serial interface with main processor data synchronization
    • TDM controller interface
    • Embedded sensor fusion low-power (SFLP) algorithm
    • Programmable finite state machine for accelerometer, gyroscope, and analog hub / Qvar sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded adaptive self-configuration (ASC)
    • Smart FIFO up to 4.5 KB
    • Embedded analog hub for analog-to-digital conversion and processing analog input data
    • Embedded Qvar: electric charge variation detection
    • Embedded temperature sensor
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.71 mm
    • ECOPACK and RoHS compliant

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - ISM330BX

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LGA 14L 2.5x3x0.74 mm Ecopack2



LGA 14L 2.5x3x0.74 mm

Material Declaration**:


Marketing Status



LGA 14L 2.5x3x0.74 mm

RoHS Compliance Grade


(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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