Product overview
Description
The ISM330BX is a system-in-package inertial measurement unit (IMU) featuring a 3‑axis digital accelerometer and a 3-axis digital gyroscope with triple channels for processing acceleration and angular rate data for motion tracking and vibration measurements along with Qvar sensing on up to three separate channels with dedicated configuration, processing, and filtering.
The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.
The ISM330BX embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), adaptive self-configuration (ASC), and machine learning core (MLC) with exportable AI features/filters for IoT applications.
The ISM330BX integrates a 6-axis IMU sensor in a compact package (2.5 x 3.0 x 0.71 mm).
-
All features
- 3-axis accelerometer with selectable full scale: ±2/±4/±8 g
- 3-axis gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
- 3-axis accelerometer with flat, wide bandwidth (2 kHz) frequency response and low noise (70 μg/√Hz over the SPI/I²C/I3C interface and even down to 30 μg/√Hz over the TDM interface)
- Low supply current in high-performance mode: 0.6 mA in combo mode; 0.19 mA accelerometer only
- SPI / I²C / MIPI I3C® v1.1 serial interface with main processor data synchronization
- TDM controller interface
- Embedded sensor fusion low-power (SFLP) algorithm
- Programmable finite state machine for accelerometer, gyroscope, and analog hub / Qvar sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded adaptive self-configuration (ASC)
- Smart FIFO up to 4.5 KB
- Embedded analog hub for analog-to-digital conversion and processing analog input data
- Embedded Qvar: electric charge variation detection
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Compact footprint: 2.5 mm x 3 mm x 0.71 mm
- ECOPACK and RoHS compliant
You might also like...
Recommended for you
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ISM330BX
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| ISM330BXTR | Active | LGA 14L 2.5x3x0.74 mm | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| ISM330BXTR | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
ISM330BXTR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors