Product overview
Description
The LSM6DSO16IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in personal electronics and IoT solutions.
The LSM6DSO16IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. The module features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The LSM6DSO16IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any personal electronics, from wearable accessories to high-end applications.
The LSM6DSO16IS is available in a plastic land grid array (LGA) package.
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All features
- 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
- Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience
- Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)
- Low noise: 70 μg/√Hz in high-performance mode
- Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
- SPI / I²C serial interface
- Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
- Temperature range from -40 to +85 °C
- Embedded temperature sensor
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
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STMicroelectronics - LSM6DSO16IS
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Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|
| LSM6DSO16ISTR | Active Product is in volume production. | LGA 14L 2.5x3x0.86 mm | Ecopack2 | - | - |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Budgetary Price (US$)*/Qty | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||
| LSM6DSO16ISTR | 3 distributors | Active | LGA 14L 2.5x3x0.86 mm | Tape and Reel | ITALY | EAR99 | NEC | -40 | 85 | |
Buy Direct at ST (*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors