LSM6DSO16IS

Preview

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with STRed - Intelligent Sensor Processing Unit

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Product overview

Description

The LSM6SO16IS is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in personal electronics and IoT solutions. The LSM6DSO16IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSO16IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The LSM6DSO16IS embeds a new ST category of processing, STRed - ISPU (Intelligent Sensor Processing Unit) to support real-time applications that rely on sensor data. STRed-ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the Edge. The main benefits of the STRed-ISPU are C programming, debugging and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any personal electronics, from wearable accessories to high-end applications (for example, smartwatches, convertible laptops, smartphones, and so on).
The LSM6DSO16IS is available in a plastic land grid array (LGA) package.
  • All features

    • 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
    • 3D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
    • Embedded STRed-ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the Edge for a seamless digital-life experience
    • Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, STRed-ISPU not included)
    • Low noise: 70 μg/√Hz in high-performance mode
    • Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
    • SPI / I²C serial interface
    • Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
    • Temperature range from -40 to +85 °C
    • Embedded temperature sensor
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • ECOPACK, RoHS and “Green” compliant

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      IMU383ZA

      Active

      High-performance inertial platform

      Hardware Integrated Devices from Partners ACEINNA
      IMU383ZA

      Description:

      High-performance inertial platform

      SensiBLE

      Active

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE

      Description:

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      SensiSUB

      Active

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network

      Hardware Integrated Devices from Partners SensiEDGE
      SensiSUB

      Description:

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network
    • Part number
      Status
      Description
      Type
      Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Design Services from Partners FAE Technology
      FAE Engineering Services

      Description:

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Design Services from Partners SensiEDGE
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DSO16IS

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LSM6DSO16IS
Preview
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2
LSM6DSO16ISTR
Preview
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSO16IS

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

Marketing Status

Preview

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

LSM6DSO16ISTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

Marketing Status

Preview

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LSM6DSO16ISTR No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tape And Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES
LSM6DSO16IS No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tray VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES

LSM6DSO16ISTR

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

LSM6DSO16IS

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tray

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors