Design Win

6-axis IMU with sensor fusion, AI, Qvar, hearable features for TWS

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Product overview


The LSM6DSV16BX is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with triple channels for processing acceleration and angular rate data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction along with Qvar sensing on three separate channels with dedicated configuration, processing, and filtering.

The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.

The LSM6DSV16BX embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), adaptive self-configuration (ASC), and machine learning core (MLC) with exportable AI features/filters for IoT applications.

The LSM6DSV16BX integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).

  • All features

    • Triple channels for motion tracking, bone conduction, and Qvar sensing
    • Power consumption: 0.95 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 4.5 KB
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000/±4000 dps full scale
    • 3-axis audio accelerometer ​with flat and wide bandwidth > 1 kHz ​ and low noise 20 μg /√Hz
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • TDM slave interface
    • Advanced pedometer, step detector, and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click
    • Programmable finite state machine for accelerometer, gyroscope, and Qvar sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded adaptive self-configuration (ASC)
    • Embedded Qvar: electric charge variation detection
    • Embedded analog hub for ADC and processing analog input data
    • Embedded sensor fusion low-power algorithm
    • Embedded temperature sensor
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.71 mm
    • ECOPACK and RoHS compliant

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STMicroelectronics - LSM6DSV16BX

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LGA 14L 2.5x3x0.74 mm Ecopack2



LGA 14L 2.5x3x0.74 mm

Material Declaration**:


Marketing Status



LGA 14L 2.5x3x0.74 mm

RoHS Compliance Grade


(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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