LSM6DSV80X
Active
Education Design Win
6-axis IMU (inertial measurement unit) with high-g accelerometer, embedded AI, and sensor fusion for wearables and sport trackers

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Product overview

Key Benefits

Accurately measuring high and low accelerations

Capture and process all relevant data even in extreme situations unlocking new possibilities.

Processing at the edge

Best system optimization with processing at the edge and self-configuration.

PCB spacing and BOM cost reduction

A single IMU that embeds two accelerometer structures (16g + 80g) and a gyroscope.

Description

The LSM6DSV80X is a breakthrough in the world of wearable technology. Its ability to handle both high and low acceleration values, combined with its energy efficiency and advanced processing capabilities, makes it a sensor for anyone looking to acquire data for in-depth analysis and achieve better performance in high-intensity impact and tracking activities in sports such as volleyball, soccer, tennis, boxing, or explosive jumps, and so forth. This IMU is a comprehensive solution for wearables, high-intensity impact and activity tracking, offering a blend of accuracy, integration, and efficiency.

The LSM6DSV80X is the world's first IMU to combine high-g (80 g) and low-g capabilities in a single package, integrating advanced features (edge processing and sensor fusion) and delivering consistent performance and valuable data for tracking and high-intensity impact detection in sports wearables.

The device enables edge AI, leveraging on a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for wearable applications.

The LSM6DSV80X supports the adaptive self-configuration (ASC) feature, which allows automatically reconfiguring the device in real time based on the detection of a specific motion pattern or based on the output of a specific decision tree configured in the MLC, without any intervention from the host processor.

  • All features

    • Dedicated and independent gyroscope, low-g and high-g accelerometer channels, and data processing
    • Smart FIFO up to 4.5 KB
    • Dual accelerometer channels
      • Low-g channel ±2/±4/±8/±16 g full scale
      • High-g channel ±32/±64/±80 g full scale
    • ±250/±500/±1000/±2000/±4000 dps full scale
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • Programmable finite state machine for high-g and low-g accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded adaptive self-configuration (ASC)
    • Embedded sensor fusion low-power (SFLP) algorithm
    • Embedded temperature sensor
    • Independent I/O supply
      • I²C voltage range: 1.62 V to 3.6 V
      • SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V
    • Supply current
      • 6-axis configuration @ 0.67 mA in combo high-performance mode
      • 9-axis configuration @ 0.80 mA in combo high-performance mode
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • ECOPACK and RoHS compliant

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STMicroelectronics - LSM6DSV80X

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
LSM6DSV80XTR
Active
LGA 14L 2.5x3x0.86 mm Ecopack2 - -

LSM6DSV80XTR

Package:

LGA 14L 2.5x3x0.86 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LGA 14L 2.5x3x0.86 mm

RoHS Compliance Grade

Ecopack2

Longevity Commitment

-

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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