MPX2300D
Active
Design Win
0 to 40 kPa, differential compensated pressure sensor

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Product overview

Description

The MPX23001 is a high volume, miniature pressure sensor package, which is ideal as a submodule component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses a unique sensor die with piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration.

  • All features

    • Integrated temperature compensation and calibration
    • Ratiometric to supply voltage
    • Polysulfone case material (ISO 10993)
    • Provided in easy-to-use tape and reel

EDA Symbols, Footprints and 3D Models

STMicroelectronics - MPX2300D

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

Symbols

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Footprints

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3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
MPX2300DT1
Active
- Ecopack1 - -

MPX2300DT1

Package:

-

Material Declaration**:

Marketing Status

Active

Package

-

RoHS Compliance Grade

Ecopack1

Longevity Commitment

-

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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MPX2300DT1

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MPX2300DT1 Active

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors