Product overview
Description
This ACEPACK 2 power module in fourpack topology integrates advanced silicon carbide Power MOSFET technology from STMicroelectronics. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate. The result is exceptionally low on-resistance per unit area and excellent switching performance that is virtually independent of temperature. An NTC sensor completes the design.
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All features
- Fourpack topology
- ACEPACK 2 power module
- 13 mΩ of typical RDS(on) each switch
- Insulation voltage UL certified of 2.5 kVrms
- Integrated NTC temperature sensor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
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