EMIF02-SPK02F2

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2-line IPAD™ EMIF filter and ESD protection

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Product overview

Description

The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.

Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

  • All features

    • Packaged in lead-free Flip Chip
    • Very low resistance: 0.35 Ω
    • High attenuation: -45 dB at 900 MHz
    • Very low PCB space consumption:0.89 mm x 1.26 mm
    • Very thin package: 0.65 mm
    • High efficiency in ESD suppressionIEC6 1000-4-2 level 4
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging
    • Complies with the following standards
      • IEC 61000-4-2 level 4:
        • ±15 kV (air discharge)
        • ±8 kV (contact discharge)

EDA Symbols, Footprints and 3D Models

STMicroelectronics - EMIF02-SPK02F2

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF02-SPK02F2
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CSP P 0.5 mm Industrial Ecopack2

EMIF02-SPK02F2

Package:

CSP P 0.5 mm

Material Declaration**:

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Marketing Status

Active

Package

CSP P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors