Product overview
Description
The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
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All features
- Packaged in lead-free Flip Chip
- Very low resistance: 0.35 Ω
- High attenuation: -45 dB at 900 MHz
- Very low PCB space consumption:0.89 mm x 1.26 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppressionIEC6 1000-4-2 level 4
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
- Complies with the following standards
- IEC 61000-4-2 level 4:
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
- IEC 61000-4-2 level 4:
EDA Symbols, Footprints and 3D Models
STMicroelectronics - EMIF02-SPK02F2
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3D models
All resources
| Resource title | Version | Latest update |
|---|
HW Models (1)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.1 | 11 Jun 2021 | 11 Jun 2021 | ||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |