Product overview
Description
The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference.
The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
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All features
- High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
- Very thin package: 0.65 mm
- High reduction of parasitic elements through integration and wafer level packaging
- High efficiency EMI filtering (-40 dB @ 900 MHz)
- Low serial resistance for camera impedance adaptation
- Low line capacitance suitable for high speed data bus
- Optimized PCB space occupation: 2.92 mm x 1.29 mm
- High reliability offered by monolithic integration
- Lead-free package
EDA Symbols, Footprints and 3D Models
The STMicroelectronics team - EMIF06-VID01F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | ||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |