ST33KTPM2XI2C

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TPM 2.0 devices with an SPI or I2C interface for consumer

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Product overview

Description

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile, and computing applications.

It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity, and authenticity of information and devices.

The STSAFE-TPM devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.

The STSAFE-TPM devices target Common Criteria, TCG, and FIPS certification.

The ST33KTPM2XI2C offers a target serial peripheral interface (SPI) or a target I²C interface, both compliant with the TCG PC Client TPM Profile specifications.

It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.

The ST33KTPM2XI2C operates in the –40 °C to 105 °C extended temperature range.

The device is offered in the UFQFPN32 ECOPACK2 package. ECOPACK is an ST trademark.

The commercial name

used for the first released product listed in the

is replaced by ST33KTPM2X on future products, to better reflect the product interface flexibility

  • All features

    • TPM features
      • Flash-memory-based trusted platform module ()
      • Compliant with Trusted Computing Group () trusted platform module () Library specifications 2.0, revision 1.59 errata version 1.4 and PC Client Platform Profile (PTP) for 2.0 Version 1.05
      • Fault-tolerant firmware loader that keeps the fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • Common Criteria EAL4+ in compliance with the TPM 2.0 protection profile (augmented with AVA_VAN.5, resistant to high-potential attacks)
        • FIPS 140-3
        • TCG certification
      • SPI communication bus running at up to 66 MHz
      • I²C communication bus running at up to 1 Mb/s
    • Hardware features
      • Highly reliable flash memory with error correction code
      • Extended temperature range: −40 °C to 105 °C
      • Electrostatic discharge (ESD) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield
      • Monitoring of environmental parameters
      • Hardware and software protection against fault injection and side channel attacks
      • SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
      • SP800-90B and AIS31-compliant true random-number generator ()
      • Cryptographic algorithms:
        • RSA key generation (1024, 2048, 3072 and 4096 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2 and SHA-3
        • AES-128,192 and 256 bits
        • ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
      • Device provided with 3 endorsement keys () and certificates (RSA2048, P_256 and P_384)
      • Device provisioned with three 2048-bit key pairs to reduce the provisioning time
    • Product's targeted compliance
      • Compliant with Microsoft ® Windows® 10 and 11
      • Compliant with Linux® drivers
      • Compliant with Intel® vPro® technology
      • Compliant with test suite for 2.0
      • Compliant with the open-source TCG TPM 2.0 TSS implementation

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST33KTPM2XI2C

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ST33KTPM2X32CKE3
Active
UFQFPN 32 5x5x0.55 mm Ecopack2

ST33KTPM2X32CKE3

Package:

UFQFPN 32 5x5x0.55 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

UFQFPN 32 5x5x0.55 mm

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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ST33KTPM2X32CKE3
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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors