The ST54F is an all-in-one solution including ST21NFCD NFC controller and ST33G1M2 or ST33I1M2 Secure Element with the highest security level (EAL6+ and EMVCo certified hardware).
Fully manufactured in a secure environment, the ST33 provides the highest performance levels thanks to its ARM® SC300® core.
The 64-ball WFBGA (4 x 4 x 0.8 mm) ECOPACK® package provides a reduced footprint and pin-to-pin compatibility with the STMicroelectronics NFC standalone solution. There is no internal direct connection between the two devices inside the package.
A complete range of memory sizes up to 2048 Kbyte (depending on profile) of non-volatile Flash memory is available on the Secure Element.
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
|DB3194: NFC controller and Secure Element system-in-package||2.0||143 KB|
|Brochure Secure MCUs - Secure Solutions||1.2||2 MB|
|NFC solutions from ST||1.0||3 MB|
|ST’s solutions for mobile devices||2 MB|
|Part Number||Marketing Status||Quantity||Unit Price (US$) *||Package||Packing Type||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|ST54F||Active : Product is in volume production||-||-||CDIP 24 .610 S/B||Tube||5A002A1||FRANCE||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|ST54F||Active||CDIP 24 .610 S/B||Industrial||N/A|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.