BAL-UWB-01E3

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Design Win

50Ω to 100Ω balun for UWB 3GHz to 8GHz

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Product overview

Description

The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.

This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

  • All features

    • Very low profile
    • High RF performance
    • PCB space saving
    • Efficient manufacturability
    • LGA footprint compatible
    • Low thickness ≤ 450 µm

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BAL-UWB-01E3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BAL-UWB-01E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BAL-UWB-01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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BAL-UWB-01E3
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BAL-UWB-01E3 Active

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Package:
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Part Number:

BAL-UWB-01E3

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Minimum Sellable Quantity:

5000

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors