BALF-ATM-01E3

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Design Win

50 ohms / matched to ATSAMR21E18 balun transformer, with integrated harmonic filter

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Product overview

Description

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.

  • All features

    • 2.4 – 2.5 GHz balun with integrated matching network
    • Matching optimized for following chipsets: ATSAMR21E18
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated CSP on glass bumpless
    • Small footprint 2.5 mm²

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-ATM-01E3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-ATM-01E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BALF-ATM-01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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BALF-ATM-01E3
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BALF-ATM-01E3

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5000

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors