BALF-CC25-02D3

NRND
Design Win

50Ω / conjugate match to CC2541

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Product overview

Description

STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers.

It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

  • All features

    • 2.45 GHz balun with integrated matching network
    • Matching optimized for following CC2541
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated Flip-Chip on glass
    • Small footprint: < 0.88 mm²
    • Benefits
      • Very low profile
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-CC25-02D3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-CC25-02D3
NRND
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-CC25-02D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

Marketing Status

NRND

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
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Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
Unit Price (US$)
Country of Origin
min
max
BALF-CC25-02D3 Available at distributors

Distributor availability of BALF-CC25-02D3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
NRND
EAR99 NEC Tape and Reel Chip Scale Package 0.4mm pitch -40 105 5000

0.154

FRANCE

BALF-CC25-02D3 NRND

Package:
Chip Scale Package 0.4mm pitch
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

BALF-CC25-02D3

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

105

Minimum Sellable Quantity:

5000

Country of Origin:

FRANCE

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors