Product overview
Description
STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers.
It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.
-
All features
- 2.45 GHz balun with integrated matching network
- Matching optimized for following CC2541
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on glass
- Small footprint: < 0.88 mm²
- Benefits
- Very low profile
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
Recommended for you
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BALF-CC25-02D3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update | Actions | Details | Download |
|---|
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | Actions | Options | |
|---|---|---|---|---|---|
| ZIP | 1.0 | 07 Jun 2021 | 07 Jun 2021 | ||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |