BALF-WL-00D3

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Balun,filtering and matching for STM32WL high power and low power in BGA package system in package

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Product overview

Description

STMicroelectronics BALF-WL-00D3 is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers.

It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.

  • All features

    • Module STM32WL sub-GHz wireless microcontrollers impedance matched balun and Tx harmonics filter
    • Optimized for module STM32WL sub-GHz wireless microcontrollers in high and low power modes and dedicated to module package
    • 50 Ω nominal input / conjugate match balun to module STM32WL
    • 50 Ω nominal impedance on antenna side Tx and Rx
    • Deep Tx rejection harmonic filter
    • Low insertion loss
    • Small footprint
    • Low profile ≤ 630 μm after reflow
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK2 compliant component

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-WL-00D3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-WL-00D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-WL-00D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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BALF-WL-00D3
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BALF-WL-00D3

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors