BALFLB-WL-09D3

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balun,filtering and matching of STM32WL 17dbm 490Mhz , QFN package 2 layers pcb

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Product overview

Description

STMicroelectronics BALFLB-WL-09D3 is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers.

It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.

  • All features

    • QFN STM32WL sub-GHz wireless microcontrollers impedance matched balun and Tx harmonics filter
    • Optimized for QFN STM32WL sub-GHz wireless microcontrollers in high power mode and dedicated to 2-layers PCB
    • 50 Ω nominal input / conjugate matched balun to QFN STM32WL
    • 50 Ω nominal impedance on antenna side Tx and Rx
    • Deep Tx rejection harmonic filter
    • Low insertion loss
    • Small footprint
    • Low profile ≤ 630 μm after reflow
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK2 compliant component

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STMicroelectronics - BALFLB-WL-09D3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALFLB-WL-09D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALFLB-WL-09D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
Unit Price (US$)
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min
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BALFLB-WL-09D3 Available at distributors

Distributor availability of BALFLB-WL-09D3

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Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape and Reel Chip Scale Package 0.4mm pitch 105 -40 5000

0.32

CHINA

BALFLB-WL-09D3 Active

Package:
Chip Scale Package 0.4mm pitch
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

BALFLB-WL-09D3

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

105

Max:

-40

Minimum Sellable Quantity:

5000

Country of Origin:

CHINA

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors