MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, TFT display, FD-CAN, Secure boot and Cryptography

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  • The STM32MP153C devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 650 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

    The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
    The STM32MP153C devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
    The STM32MP153C devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
    The STM32MP153C devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
    All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

    主な特徴

    • コア
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

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125

Unit Price (US$)

7.94

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10000

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5A992C

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STM32MP153CAA3T

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LFBGA448

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Junction Temperature (°C) (min)

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Junction Temperature (°C) (max)

125

Unit Price (US$)

8.82

数量

10000

ECCN (US)

5A992C

Country of Origin

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STM32MP153CAD3T

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TFBGA257

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Junction Temperature (°C) (min)

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Junction Temperature (°C) (max)

125

Unit Price (US$)

7.64

数量

10000

ECCN (US)

5A992C

Country of Origin

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STM32MP153CAD3

パッケージ

TFBGA257

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Unit Price (US$)

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代理店レポートによる在庫データ: 2019-12-06

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Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

7.64

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAA3

パッケージ

LFBGA448

梱包タイプ

Tray

Unit Price (US$)

8.82*

Distributor availability ofSTM32MP153CAA3

代理店名
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MOUSER WORLDWIDE 100 1 Order Now
Farnell Element14 EUROPE 100 1 Order Now

代理店レポートによる在庫データ: 2019-12-06

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代理店レポートによる在庫データ: 2019-12-06

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アクティブ

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.82

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAB3T

パッケージ

LFBGA354

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Tape And Reel

Unit Price (US$)

8.02*

製品ステータス

アクティブ

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.02

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAC3

パッケージ

TFBGA361

梱包タイプ

Tray

Unit Price (US$)

7.94*

Distributor availability ofSTM32MP153CAC3

代理店名
地域 在庫 最小発注 Third party link
MOUSER WORLDWIDE 100 1 Order Now
Farnell Element14 EUROPE 100 1 Order Now

代理店レポートによる在庫データ: 2019-12-06

代理店名

MOUSER

在庫

100

Min.Order

1

地域

WORLDWIDE Order Now

Farnell Element14

在庫

100

Min.Order

1

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-12-06

製品ステータス

アクティブ

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

7.94

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAB3

パッケージ

LFBGA354

梱包タイプ

Tray

Unit Price (US$)

8.02*

Distributor availability ofSTM32MP153CAB3

代理店名
地域 在庫 最小発注 Third party link
MOUSER WORLDWIDE 100 1 Order Now
Farnell Element14 EUROPE 100 1 Order Now

代理店レポートによる在庫データ: 2019-12-06

代理店名

MOUSER

在庫

100

Min.Order

1

地域

WORLDWIDE Order Now

Farnell Element14

在庫

100

Min.Order

1

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-12-06

製品ステータス

アクティブ

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.02

数量

10000

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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技術文書

    • 概要 バージョン サイズ アクション
      DS12503
      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 37 comm. interfaces, 29 timers, adv. analog, crypto
      2.0
      3.5 MB
      PDF
      DS12503

      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 37 comm. interfaces, 29 timers, adv. analog, crypto

    • 概要 バージョン サイズ アクション
      AN5168
      DDR configuration on STM32MP1 Series MPUs
      1.0
      374.96 KB
      PDF
      AN5348
      FDCAN peripheral on STM32 devices
      1.0
      365.06 KB
      PDF
      AN5031
      Getting started with STM32MP1 Series hardware development
      1.0
      1.86 MB
      PDF
      AN4803
      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs
      2.0
      2.1 MB
      PDF
      AN5027
      Interfacing PDM digital microphones using STM32 MCUs and MPUs
      2.0
      1.83 MB
      PDF
      AN5253
      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines
      1.0
      206.89 KB
      PDF
      AN5122
      STM32MP1 Series DDR memory routing guidelines
      3.0
      734.71 KB
      PDF
      AN5284
      STM32MP1 Series system power consumption
      1.0
      223.69 KB
      PDF
      AN5109
      STM32MP1 Series using low-power modes
      3.0
      1.11 MB
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      AN5256
      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration
      1.0
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      AN2639
      Soldering recommendations and package information for Lead-free ECOPACK MCUs and MPUs
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      AN5348

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      AN5031

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      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs

    • 概要 バージョン サイズ アクション
      RM0442
      STM32MP153 advanced Arm®-based 32-bit MPUs
      3.0
      77.89 MB
      PDF
      RM0442

      STM32MP153 advanced Arm®-based 32-bit MPUs

    • 概要 バージョン サイズ アクション
      PM0214
      STM32 Cortex®-M4 MCUs and MPUs programming manual
      8.0
      2.94 MB
      PDF
      PM0214

      STM32 Cortex®-M4 MCUs and MPUs programming manual

    • 概要 バージョン サイズ アクション
      ES0438
      STM32MP151x/3x/7x device errata
      2.0
      391.26 KB
      PDF
      ES0438

      STM32MP151x/3x/7x device errata

HWモデル、CADライブラリ & SVD

    • 概要 バージョン サイズ アクション
      STM32MP1 CAD Symbol and Footprint files 1.3
      1.82 MB
      ZIP
      STM32MP1 Lauterbach Trace Script 1.0
      105.69 KB
      ZIP
      STM32MP1 System View Description 1.0
      247.84 KB
      ZIP

      STM32MP1 CAD Symbol and Footprint files

      STM32MP1 Lauterbach Trace Script

      STM32MP1 System View Description

    • 概要 バージョン サイズ アクション
      STM32MP1 BSDL file 1.0
      80.24 KB
      ZIP
      STM32MP1 IBIS file 1.0
      31.99 MB
      ZIP

      STM32MP1 BSDL file

      STM32MP1 IBIS file

プレゼンテーション & トレーニング資料

    • 概要 バージョン サイズ アクション
      STM32 and STM8 software development tools 06.2019
      1.34 MB
      PDF
      STM32MP1 Microprocessor - Continuing the STM32 Success Story 1.1
      2.3 MB
      PDF

      STM32 and STM8 software development tools

      STM32MP1 Microprocessor - Continuing the STM32 Success Story

ハードウェアリソース

    • 概要 バージョン サイズ アクション
      STM32MP1 Series DDR memory routing guidelines examples 2.0
      21.34 MB
      ZIP

      STM32MP1 Series DDR memory routing guidelines examples

関連資料

    • 概要 バージョン サイズ アクション
      STM32MP1 Series Microprocessors 19.02
      216.16 KB
      PDF

      STM32MP1 Series Microprocessors

製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード Material Declaration**
STM32MP153CAA3
アクティブ
LFBGA448 インダストリアル Ecopack2
STM32MP153CAA3T
アクティブ
LFBGA448 インダストリアル Ecopack2
STM32MP153CAB3
アクティブ
LFBGA354 インダストリアル Ecopack2
STM32MP153CAB3T
アクティブ
LFBGA354 インダストリアル Ecopack2
STM32MP153CAC3
アクティブ
TFBGA361 インダストリアル Ecopack2
STM32MP153CAC3T
アクティブ
TFBGA361 インダストリアル Ecopack2
STM32MP153CAD3
アクティブ
TFBGA257 インダストリアル Ecopack2
STM32MP153CAD3T
アクティブ
TFBGA257 インダストリアル Ecopack2

STM32MP153CAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

アクティブ

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

アクティブ

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

アクティブ

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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