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STMicroelectronics presents ACEPACK SMIT: a surface-mount power module with top-side cooling, which ensures higher power density and improved thermal management for very efficient and more compact systems.
Automotive SiC MOSFETs
STMicroelectronics presents ACEPACK SMIT: a surface-mount power module with top-side cooling, which ensures higher power density and improved thermal management for very efficient and more compact systems.
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