The X-CUBE-PWRMGT-H7 Expansion Package consists of two low‑power application cases. These are based on I2C transmission, for instance between STM32H7x3/A3/B3 devices and the HTS221 humidity and temperature sensor, embedded in the X‑NUCLEO‑IKS01A2 expansion board.
The purpose of the two packages is to highlight the smart power management of the STM32H7 Series, using three power domains for the STM32H7x3 devices and two power domains for the STM32H7Ax/Bx devices. The goal is also to minimize the power consumption while maintaining some activities running when needed (SRD or D3 autonomous mode: SRD for the STM32H7Ax/Bx devices and D3 for the STM32H7x3 devices).
The X-CUBE-PWRMGT-H7 Expansion Package contains two software packages. Package1 is developed on the NUCLEO-H743ZI Nucleo board. Package2 is developed on the NUCLEO-H7A3ZI-Q Nucleo board.
Package1 contains four modes in which the STM32H7x3 exchanges data with the HTS221 temperature sensor. For each mode, the microcontroller power consumption is reduced because of the flexible architecture of STM32H7, which manages power supply per domain.
Package2 contains six modes in which the STM32H7A3x exchanges data with the HTS221 temperature sensor. For each mode, the microcontroller power consumption is reduced because of the flexible architecture of STM32H7, which manages power supply per domain.
A terminal display monitors the two package cases through the USB Virtual COM port communication between the MCU and the PC. The example is developed with the STM32Cube Expansion Package. It is compatible with the IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE toolchains, and can be easily tailored for any other toolchain.