Product overview
Description
The B-WBA5M-WPAN STM32WBA connectivity expansion board provides an affordable and flexible way for users to try out new concepts and build prototypes with the STM32WBA series STM32WBA5MMGH6 module.
The B-WBA5M-WPAN product requires a separate probe for programming and debugging. The STLINK-V3SET debugger can be connected through an STDC14 cable.
The B-WBA5M-WPAN STM32WBA connectivity expansion board integrates a USB Type-C® connector for power only.
The B-WBA5M-WPAN STM32WBA connectivity expansion board integrates an M.2 E‑Key connector, turning it into an M.2 E‑Key daughterboard providing a Bluetooth® interface to a host board including an M.2 E‑Key host connector.
The M.2 E‑Key connector follows the PCI-SIG standard and provides UART, SPI, I2C, and SAI interfaces for communication with the host.
The B-WBA5M-WPAN product includes the comprehensive STM32WBA software HAL library and various packaged software examples with the STM32CubeWBA MCU Package.
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All features
- STM32WBA connectivity expansion board embedding an STM32WBA5MMG module including:
- Ultra‑low‑power Arm® Cortex®‑M33 core‑based STM32WBA55UG microcontroller, Bluetooth® LE 5.4, AES‑256, featuring 1 Mbyte of flash memory and 128 Kbytes of SRAM, including 64 Kbytes with parity check
- RF transceiver multistandard radio Bluetooth® LE, compliant with Bluetooth® specification 5.4
- 256‑Kbit serial I2C bus EEPROM
- MEMS sensors:
- Integrated high-accuracy temperature sensor
- 3D accelerometer and 3D gyroscope
- User LED
- User and reset push buttons
- Board connectors:
- STDC14 debug
- USB Type-C® for power only
- M.2 E‑Key
- Flexible power supply options: M.2 E‑Key connector or USB VBUS
- Comprehensive free software libraries and examples available with the STM32CubeWBA MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- STM32WBA connectivity expansion board embedding an STM32WBA5MMG module including:
All resources
Resource title | Version | Latest update |
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Board Manufacturing Specifications (2)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 21 Mar 2025 | 21 Mar 2025 | |
ZIP | 1.0 | 21 Mar 2025 | 21 Mar 2025 |
Bill of Materials (1)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 21 Mar 2025 | 21 Mar 2025 |
Schematic Pack (1)
Resource title | Version | Latest update | ||
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1.0 | 17 Mar 2025 | 17 Mar 2025 |
Quality and Reliability
Part Number | Marketing Status | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
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B-WBA5M-WPAN | Active | Ecopack1 | - | - | |
B-WBA5M-WPAN
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Specific features | WEEE Compliant | Core Product | |
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B-WBA5M-WPAN | | | distributors No availability of distributors reported, please contact our sales office |
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B-WBA5M-WPAN Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors