VD56GA
Proposal
Design Win
1.1 MPixel Image sensor with Global Shutter. Automotive-grade, Functional Safety, Cybersecurity, CSP Package

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Product overview

Key Benefits

System-level cost efficiency

High QE and MTF enable sharper images, support single-LED or low-power LED designs, and reduce assembly system cost.

Compact footprint

3.7 x 3.1 mm package, enabling discreet next-generation in-cabin camera designs and space-constrained installations.

In-cabin automotive compliance

Built for reliability, extended temperature range, and automotive cybersecurity and safety requirements (AEC-Q100 Grade 2, ISO 26262, ISO/SAE 21434).

Description

The VD56GA is a 1.1 megapixel global shutter image sensor with superhigh performance 2.43 μm pixels, allowing virtual 2-megapixels compliancy for automotive driver monitoring applications.

The virtual 2-megapixel performance is enabled by the ST DeepNIR technology featuring unrivaled MTF performance.

This ST DeepNIR technology offers excellent sensitivity with 43% QE at 940 nm enabling the VD56GA to operate with only one low-power LED.

The small CSP package footprint, more than three times smaller than the previous generation, combined with the ISO26262 and ISO21434 compliancy, makes VD56GA the optimal image sensor for driver monitoring systems.

  • All features

    • Automotive compliancy
      • AEC-Q100 grade 2 under qualification
      • Operating junction temperature: -40°C to 125°C
      • ISO26262 compliant to support ASILB system integration
      • ISO21434 compliant with exhaustive cybersecurity features
    • Ultracompact and high MTF 1.1 megapixel image sensor
      • Global shutter architecture, 3D BGS stacked sensor 40 nm/65 nm
      • 2.43 μm x 2.43 μm BSI pixel with ST DeepNIR technology
      • 1.1 megapixel monochrome sensor (1152 x 920) operating at 60 frames per second
      • Package: CSP
        • Size: 3.7 mm x 3.1 mm
        • Matrix: 6 x 5 balls
        • Ball pitch: 550 μm
      • Optical format < 1/5’’ (3.58 mm diag)
      • µlens shift to match 20° linear CRA
    • Unique imaging performance for virtual 2-megapixel performance
      • Absolute quantum efficiency 41% @ 940 nm
      • Outstanding MTF performance
    • Easy and up-to-date integration
      • Embedded autoexposure with tunable ROI
      • 8- and 10-bit output (PWL 10 bit to 8 bit), YUV (monochrome) 422 8-bit
      • Dual lane transmitter MIPI CSE FSED up to 1.5 Gbps per lane
      • Three programmable GPIOs:
        • Output synchronized with sensor integration periods
        • PWM (pulse-width modulation) control
      • Region of interest, two image context management
      • Automatic dark calibration and defective pixel correction
      • Image cropping
      • Mirror/flip readout
      • Analog binning 2 x 2 and analog subsampling ½

EDA Symbols, Footprints and 3D Models

STMicroelectronics - VD56GA

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
VD56GA
Proposal
CSP Industrial - - -

VD56GA

Package:

CSP

Material Declaration**:

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Proposal

Package

CSP

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Industrial

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-

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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VD56GA Proposal

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors