Product overview
Description
The IIS3DWB is a system-in-package featuring a 3-axis digital vibration sensor with low noise over an ultra-wide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +105 °C), make the device particularly suitable for vibration monitoring in industrial applications. The high performance delivered at low power consumption together with the digital output and the embedded digital features like the FIFO and the interrupts are enabling features for battery-operated industrial wireless sensor nodes.The IIS3DWB has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring accelerations with a bandwidth up to 6 kHz with an output data rate of 26.7 kHz. A 3 kB first-in, first-out (FIFO) buffer is integrated in the device to avoid any data loss and to limit intervention of the host processor.
The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial and consumer markets. The sensing elements are manufactured using ST’s proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology.
The IIS3DWB has a self-test capability which allows checking the functioning of the sensor in the final application. The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40 °C to +105 °C.
-
All features
- 3-axis vibration sensor with digital output
- User-selectable full-scale: ±2/±4/±8/±16 g
- Ultra-wide and flat frequency response range: from dc to 6 kHz (±3 dB point)
- Ultra-low noise density: down to 75 µg/√Hz in 3-axis mode / 60 µg/√Hz in single-axis mode
- High stability of the sensitivity over temperature and against mechanical shocks
- Extended temperature range from -40 to +105 °C
- Low power: 1.1 mA with all 3 axes delivering full performance
- SPI serial interface
- Low-pass or high-pass filter with selectable cut-off frequency
- Interrupts for wake-up / activity - inactivity / FIFO thresholds
- Embedded FIFO: 3 kB
- Embedded temperature sensor
- Embedded self-test
- Supply voltage: 2.1 V to 3.6 V
- Compact package: LGA 2.5 x 3 x 0.83 mm 14-lead
- ECOPACK, RoHS and “Green” compliant
You might also like...
Featured Videos
A bridge between the sensor on the motherboard and your laptop
All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 31 Jan 2020 |
31 Jan 2020
|
||
| 6.0 | 01 Sep 2020 |
01 Sep 2020
|
Application Notes (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 05 Aug 2020 |
05 Aug 2020
|
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.4 | 31 Aug 2021 |
31 Aug 2021
|
Design Notes & Tips (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 |
21 Jan 2021
|
||
| 1.1 | 21 Jan 2021 |
21 Jan 2021
|
||
| 1.1 | 21 Jan 2021 |
21 Jan 2021
|
||
| 1.1 | 21 Jan 2021 |
21 Jan 2021
|
||
| 1.2 | 21 Jan 2021 |
21 Jan 2021
|
Application Notes for related Tools & Software (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Mar 2021 |
24 Mar 2021
|
Presentations (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 31 Mar 2020 |
31 Mar 2020
|
||
| 2.0 | 22 Apr 2021 |
22 Apr 2021
|
Flyers (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 19 Jan 2021 |
19 Jan 2021
|
||
| 4.0 | 04 May 2021 |
04 May 2021
|
Brochures (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 |
07 Apr 2021
|
||
| 2.1 | 06 Aug 2020 |
06 Aug 2020
|
||
| 01.21 | 19 Mar 2021 |
19 Mar 2021
|
||
| 2.0 | 25 Feb 2021 |
25 Feb 2021
|
||
| 1.0 | 23 Jun 2020 |
23 Jun 2020
|
White Papers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 04 Dec 2018 |
04 Dec 2018
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - IIS3DWB
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| IIS3DWBTR |
Active
|
VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| IIS3DWBTR | 1 distributors |
Active
|
EAR99 | NEC | Tape And Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 105 | MALTA | 9.9 | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
9.9(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors