Product overview
Description
The LIS3DHH is an ultra-high-resolution and low-noise three-axis linear accelerometer. The LIS3DHH has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LIS3DHH is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.
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All features
- 3-axis, ±2.5 g full-scale
- Ultra-low noise performance: 45 μg/√Hz
- Excellent stability over temperature (<0.4 mg/°C) and time
- 16-bit data output
- SPI 4-wire digital output interface
- Embedded temperature sensor
- 12-bit temperature data output
- Embedded FIFO (depth 32 levels)
- High shock survivability
- Extended operating temperature range (-40 °C to +85 °C)
- ECOPACK®, RoHS and “Green” compliant
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 3.0 | 08 Apr 2020 | 08 Apr 2020 |
Application Notes (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 12 Jun 2018 | 12 Jun 2018 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.3 | 29 Jun 2021 | 29 Jun 2021 |
Design Notes & Tips (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.2 | 21 Jan 2021 | 21 Jan 2021 |
Flyers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 19 Jan 2021 | 19 Jan 2021 |
Brochures (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 01.21 | 19 Mar 2021 | 19 Mar 2021 | ||
| 2.0 | 25 Feb 2021 | 25 Feb 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
White Papers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 04 Dec 2018 | 04 Dec 2018 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LIS3DHH
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LIS3DHHTR | Active | LGA 5X5X1.7 16LD CERAMIC CAVITY | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LIS3DHHTR | No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape And Reel | LGA 5X5X1.7 16LD CERAMIC CAVITY | -40 | 85 | MALTA | 6.24 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
6.24 / 1k(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
