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The LIS3DHH is an ultra-high-resolution and low-noise three-axis linear accelerometer.
The LIS3DHH has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.
The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LIS3DHH is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.Key Features
- 3-axis, ±2.5 g full-scale
- Ultra-low noise performance: 45 μg/√Hz
- Excellent stability over temperature (<0.4 mg/°C) and time
- 16-bit data output
- SPI 4-wire digital output interface
- Embedded temperature sensor
- 12-bit temperature data output
- Embedded FIFO (depth 32 levels)
- High shock survivability
- Extended operating temperature range (-40 °C to +85 °C)
- ECOPACK®, RoHS and “Green” compliant
Featured Videos
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
All resources
Product Specifications (1)
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| 08 Apr 2020 |
08 Apr 2020
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Application Notes (1)
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| 12 Jun 2018 |
12 Jun 2018
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Technical Notes & Articles (1)
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| 18 Nov 2020 |
18 Nov 2020
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Design Notes & Tips (5)
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Brochures (4)
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White Papers (1)
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| 04 Dec 2018 |
04 Dec 2018
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - LIS3DHH
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LIS3DHHTR |
Active
|
LGA 5X5X1.7 16LD CERAMIC CAVITY | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LIS3DHHTR | 4 distributors |
Active
|
EAR99 | NEC | Tape And Reel | LGA 5X5X1.7 16LD CERAMIC CAVITY | -40 | 85 | MALTA | 5.2 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
5.2 / 1k(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
