LSM6DSV16X

Evaluation
Design Win

iNEMO 3D accelerometer and 3D gyroscope: always-on inertial module with embedded machine learning core and Qvar electrostatic sensor

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Product overview

Description

The LSM6DSV16X is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with a triple core for processing acceleration and angular rate data on three separate channels with dedicated configuration, processing, and filtering. The LSM6DSV16X boosts performance at 0.65 mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSV16X embeds advanced dedicated features such as a finite state machine and MLC with an exportable AI feature for IoT applications, as well as data filtering for OIS, EIS, and motion processing.
The LSM6DSV16X embeds Qvar (electric charge variation detection) for user interface functions: tap, double-tap, triple-tap, long press, L/R – R/L swipe.
The LSM6DSV16X embeds an analog hub, which is able to connect an external analog input and convert it to a digital signal for processing.
  • All features

    • Triple core for UI, EIS, and OIS data processing
    • Power consumption: 0.65 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 4.5 KB
    • Android compliant
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000/±4000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • Auxiliary SPI for OIS data output for gyroscope and accelerometer
    • OIS configurable from aux SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
    • EIS dedicated channel on primary interface with dedicated filtering
    • Advanced pedometer, step detector, and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double-click
    • Programmable finite state machine for accelerometer, gyroscope and external sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded Qvar (electrostatic sensor) for user interface functions (tap, double-tap, triple-tap, long press, L/R – R/L swipe)
    • Embedded analog hub for ADC and processing analog input data
    • Embedded sensor fusion low-power algorithm
    • Embedded temperature sensor
    • ECOPACK and RoHS compliant

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      IMU383ZA

      Active

      High-performance inertial platform

      Hardware Integrated Devices from Partners ACEINNA
      IMU383ZA

      Description:

      High-performance inertial platform

      SensiBLE

      Active

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE

      Description:

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      SensiSUB

      Active

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network

      Hardware Integrated Devices from Partners SensiEDGE
      SensiSUB

      Description:

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network
    • Part number
      Status
      Description
      Type
      Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Design Services from Partners FAE Technology
      FAE Engineering Services

      Description:

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Design Services from Partners SensiEDGE
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
    • Part number
      Status
      Description
      Type
      Supplier

      AlgoBuilder

      Active

      Application for the graphical design of algorithms

      Sensor Software Development Tools ST
      AlgoBuilder

      Description:

      Application for the graphical design of algorithms

EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DSV16X

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LSM6DSV16XTR
Evaluation
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSV16XTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

Evaluation

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Order from distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LSM6DSV16XTR No availability of distributors reported, please contact our sales office
Evaluation
EAR99 NEC Tape and Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES

LSM6DSV16XTR Evaluation

Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

LSM6DSV16XTR

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

No availability of distributors reported, please contact our sales office
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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors