LPS22DF

Active
Education

Low-power and high-precision MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer

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Product overview

Description

The LPS22DF is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The LPS22DF provides lower power consumption, achieving lower pressure noise than its predecessor. The device comprises a sensing element and an IC interface which communicates over I²C, MIPI I3CSM or SPI interfaces from the sensing element to the application and supports a wide Vdd IO range for the digital interfaces as well. The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.
The LPS22DF is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
  • All features

    • 260 to 1260 hPa absolute pressure range
    • Current consumption down to 1.7 μA
    • Absolute pressure accuracy: 0.5 hPa
    • Low pressure sensor noise: 0.34 Pa
    • High-performance TCO: 0.45 Pa/°C
    • Embedded temperature compensation
    • 24-bit pressure data output
    • ODR from 1 Hz to 200 Hz
    • SPI, I²C or MIPI I3CSM interfaces
    • Supports 1.08 V digital interface
    • Embedded FIFO
    • Interrupt functions: Data-Ready, FIFO flags, pressure thresholds
    • Supply voltage: 1.7 to 3.6 V
    • High shock survivability: 22,000 g
    • Small and thin package
    • ECOPACK lead-free compliant

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      SensiBLE

      Active

      Certified?Bluetooth??low energy master/slave network processor module, compliant with Bluetooth v4.1

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE

      Description:

      Certified?Bluetooth??low energy master/slave network processor module, compliant with Bluetooth v4.1

      SensiBLE 2.0

      Active

      Low power single core?(SOC) system-on-chip with?32MHz 32-bit ARM? Cortex?-M0 CPU, and?Certified Bluetooth low energy (BLE) v4.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.0

      Description:

      Low power single core?(SOC) system-on-chip with?32MHz 32-bit ARM? Cortex?-M0 CPU, and?Certified Bluetooth low energy (BLE) v4.2

      SensiBLE 2.1

      Active

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM? Cortex?-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.1

      Description:

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM? Cortex?-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      SensiSUB

      Active

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network

      Hardware Integrated Devices from Partners SensiEDGE
      SensiSUB

      Description:

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network
    • Part number
      Status
      Description
      Type
      Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Design Services from Partners FAE Technology
      FAE Engineering Services

      Description:

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Design Services from Partners SensiEDGE
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

EDA Symbols, Footprints and 3D Models

STMicroelectronics - LPS22DF

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Symbols

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Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LPS22DF
Evaluation
HLGA 2X2X.8 10L EXP. SILIC .91SQ Ecopack2
LPS22DFTR
Active
HLGA 2X2X.8 10L EXP. SILIC .91SQ Ecopack2

LPS22DF

Package:

HLGA 2X2X.8 10L EXP. SILIC .91SQ

Material Declaration**:

Marketing Status

Evaluation

Package

HLGA 2X2X.8 10L EXP. SILIC .91SQ

RoHS Compliance Grade

Ecopack2

LPS22DFTR

Package:

HLGA 2X2X.8 10L EXP. SILIC .91SQ

Material Declaration**:

Marketing Status

Active

Package

HLGA 2X2X.8 10L EXP. SILIC .91SQ

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LPS22DF No availability of distributors reported, please contact our sales office
Evaluation
EAR99 NEC Tray HLGA 2X2X.8 10L EXP. SILIC .91SQ -40 85 MALTA
LPS22DFTR Available at 1 distributors

Distributor availability ofLPS22DFTR

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 45 1 Buy from Distributor

Distributor reported inventory date: 2021-11-20

Distributor Name

Farnell Element14

Stock

45

Min.Order

1

Distributor reported inventory date: 2021-11-20

Active
EAR99 NEC Tape And Reel HLGA 2X2X.8 10L EXP. SILIC .91SQ -40 85 MALTA

LPS22DF

Marketing Status

Evaluation

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tray

Package

HLGA 2X2X.8 10L EXP. SILIC .91SQ

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

MALTA

LPS22DFTR

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

Distributor availability ofLPS22DFTR

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 45 1 Buy from Distributor

Distributor reported inventory date: 2021-11-20

Distributor Name

Farnell Element14

Stock

45

Min.Order

1

Distributor reported inventory date: 2021-11-20

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

HLGA 2X2X.8 10L EXP. SILIC .91SQ

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

MALTA

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors