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The LPS25H is an ultra-compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.
The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable of detecting pressure and is manufactured using a dedicated process developed by ST.
The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.
The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LPS25H is available in a cavity holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -30 °C to +105 °C. The package is holed to allow external pressure to reach the sensing element.Key Features
- 260 to 1260 mbar absolute pressure range
- High-resolution mode: 1 Pa RMS
- Low power consumption
- Low-resolution mode: 4 μA
- High-resolution mode: 25 μA
- High overpressure capability: 20x full scale
- Embedded temperature compensation
- Embedded 24-bit ADC
- Selectable ODR from 1 Hz to 25 Hz
- SPI and I²C interfaces
- Embedded FIFO
- Supply voltage: 1.7 to 3.6 V
- High shock survivability: 10,000 g
- Small and thin package
- ECOPACK® lead-free compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LPS25H | HCLGA-10L 2.5 X 2.5 | Tray |
NRND
|
- | - | EAR99 | - | No availability of distributors reported, please contact our sales office |
LPS25H
Package
HCLGA-10L 2.5 X 2.5Packing Type
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors
Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
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Picture Part number Manufacturer Description 
X-NUCLEO-IKS01A1 ST Motion MEMS and environmental sensor expansion board for STM32 Nucleo Part NumberMotion MEMS and environmental sensor expansion board for STM32 Nucleo
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Embedded Software
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Picture Part number Manufacturer Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) 
BLUEMICROSYSTEM1 ST This SW has been replaced by FP-SNS-MOTENV1 LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
This SW has been replaced by FP-SNS-MOTENV1
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI142V1 -- LPS25H adapter board for standard DIL24 socket Part NumberLPS25H adapter board for standard DIL24 socket
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Picture Part number Manufacturer Description 
STEVAL-IDI001V1 ST A premium developer's tool for sensor hub applications 
STEVAL-IDI003V2 ST Multi-sensor RF platform sensors board Part NumberA premium developer's tool for sensor hub applications
Multi-sensor RF platform sensors board
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Support and Applications
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LPS25H |
NRND
|
HCLGA-10L 2.5 X 2.5 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
