The LPS25H is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.
The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detect pressure and is manufactured using a dedicated process developed by ST.
The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.
The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LPS25H is available in cavity and fully molded holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -30 °C to +105 °C. The package is holed to allow external pressure to reach the sensing element.
|DS9284: MEMS pressure sensor: 260-1260 hPa absolute digital output barometer||5.0||1 MB|
|AN4503: Environmental sensors: Hardware abstraction layer for Android||3.0||241 KB|
|AN4450: Hardware and software guidelines for use of LPS25H pressure sensor||2.0||590 KB|
|TN1227: How to interpret pressure and temperature readings in the LPS25H pressure sensor||1.0||182 KB|
|TN1198: Surface mount guidelines for MEMS sensors in HLGA packages||1.0||128 KB|
|LPS25HB vs LPS25H: How to upgrade to LPS25HB||1.0||194 KB|
|SensiBLE||SensiEDGE||SensiBLE is a low power, small form factor (20x30mm), ready-to-use on-board system, fitted with the following sensors: 3-axis accelerometer, 3-axis magnetometer, 3-axis digital gyroscope, pressure, microphone, relative humidity, ambient light and temperature sensors. Connectivity Bluetooth Low Energy (BLE) 4.1, as well as Low Power ARM® 32-bit Cortex®-M4 CPU with FPU and even battery are on-board as well.|
|SensiSUB||SensiEDGE||SensiSUB lowering the barriers for developers "Hardware Ready" low power, small size on the shelf Module based STMicroelectronics: Sub 1GHz RF + Sensors + MCU|
|X-NUCLEO-IKS01A1||ST||Motion MEMS and environmental sensor expansion board for STM32 Nucleo|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|BLUEMICROSYSTEM1||ST||This SW has been replaced by FP-SNS-MOTENV1|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI142V1||LPS25H adapter board for standard DIL24 socket|
|SensiEDGE Hardware customization services||SensiEDGE||On top off the shelf Hardware Ready modules, we are offering customers the possibility to customize those modules.|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LPS25H||HCLGA-10L 2.5 X 2.5||Tray||NRND : Not Recommended for New Design. Product is in volume production only to support customers ongoing production.||-||-||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|LPS25HTR||HCLGA-10L 2.5 X 2.5||Tape And Reel||Active : Product is in volume production||-||EAR99||MALTA||MORE INFO||Buy Direct Add to cart||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LPS25H||NRND||HCLGA-10L 2.5 X 2.5||Ecopack2|
|LPS25HTR||Active||HCLGA-10L 2.5 X 2.5||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.