The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.
The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.
The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
|DS10999: Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer||9.0||1 MB|
|AN4825: Ultra-compact high-performance eCompass module based on the LSM303AGR||1.0||1 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148 KB|
|DT0076: Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation||1.0||490 KB|
|DT0103: Compensating for magnetometer installation error and hard-iron effects using accelerometer-assisted 2D calibration||1.0||1 MB|
|DT0058: Computing tilt measurement and tilt-compensated e-compass||1.0||220 KB|
|DT0059: Ellipsoid or sphere fitting for sensor calibration||2.0||409 KB|
|DT0060: Exploiting the gyroscope to update tilt measure and e-compass||1.0||226 KB|
|DT0104: Exploiting the magnetometer as a virtual gyroscope at low and ultra-high spin rates||1.0||271 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192 KB|
|MEMS and Sensors, Smart solutions for IoT and enhanced user experience||1 MB|
|X-NUCLEO-IKS01A2||ST||Motion MEMS and environmental sensor expansion board for STM32 Nucleo|
|X-CUBE-MEMS-XT1||ST||Sensor and DSP algorithm software expansion for STM32Cube|
|X-CUBE-MEMS1||ST||Sensor and motion algorithm software expansion for STM32Cube|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI172V1||ST||LSM303AGR adapter board for a standard DIL 24 socket|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM303AGRTR||LGA 2X2X1 12LD PITCH 0.5MM||Tape And Reel||Active : Product is in volume production||1.485||1000||EAR99||-||MORE INFO||Free Sample Add to cart||DISTRIBUTOR AVAILABILITY|
|LSM303AGR||LGA 2X2X1 12LD PITCH 0.5MM||Tray||Evaluation : Product is under characterization. Limited Engineering samples available||-||-||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LSM303AGRTR||Active||LGA 2X2X1 12LD PITCH 0.5MM||Ecopack2|
|LSM303AGR||Evaluation||LGA 2X2X1 12LD PITCH 0.5MM||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.