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iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

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Product overview


The LSM6DSO32X is a system-in-package featuring a 3D digital accelerometer at 32 g and a 3D digital gyroscope, boosting power performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience in wearable, hard-fall detection, navigation and asset tracking applications.

The LSM6DSO32X supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DSO32X embeds a dedicated core for Machine Learning processing (MLC) and a Finite State Machine (FSM) that provides system flexibility, allowing some algorithms run in the application processor to be moved to the MEMS sensor with the advantage of consistent reduction in power consumption.

The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DSO32X the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32X is available in a plastic land grid array (LGA) package.

  • All features

    • Power consumption: 0.55 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 9 kbytes
    • Android compliant
    • ±4/±8/±16/±32 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
    • Advanced pedometer, step detector and step counter
    • Significant Motion Detection, tilt detection
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Programmable Finite State Machine: accelerometer, gyroscope and external sensors
    • Machine Learning Core
    • Embedded temperature sensor
    • ECOPACK, RoHS and “Green” compliant

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DSO32X

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2



VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:


Marketing Status



VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade


(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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