STM32L152RC

Active
Education

Ultra-low-power Arm Cortex-M3 MCU with 256 Kbytes of Flash memory, 32 MHz CPU, LCD, USB, 3xOp-amp

Download datasheet
Overview
Online design
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Partner products
Sales Briefcase

Product overview

Description

The ultra-low-power STM32L151xC and STM32L152xC devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 256 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. The STM32L151xC and STM32L152xC devices offer two operational amplifiers, one 12-bit ADC, two DACs, two ultra-low-power comparators, one general-purpose 32-bit timer, six general-purpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L151xC and STM32L152xC devices contain standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2S, three USARTs and an USB. The STM32L151xC and STM32L152xC devices offer up to 23 capacitive sensing channels to simply add a touch sensing functionality to any application.
They also include a real-time clock and a set of backup registers that remain powered in Standby mode.
Finally, the integrated LCD controller (except STM32L151xC devices) has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with the contrast independent of the supply voltage.
The ultra-low-power STM32L151xC and STM32L152xC devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to +105 °C temperature ranges. A comprehensive set of power-saving modes allows the design of low-power applications.
  • All features

    • Ultra-low-power platform
      • 1.65 V to 3.6 V power supply
      • -40 °C to 105 °C temperature range
      • 0.29µA Standby mode (3 wakeup pins)
      • 1.15 µA Standby mode + RTC
      • 0.44 µA Stop mode (16 wakeup lines)
      • 1.4 µA Stop mode + RTC
      • 8.6 µA Low-power run mode
      • 185 µA/MHz Run mode
      • 10 nA ultra-low I/O leakage
      • 8 µs wakeup time
    • Core: ARM® Cortex®-M3 32-bit CPU
      • From 32 kHz up to 32 MHz max
      • 1.25 DMIPS/MHz (Dhrystone 2.1)
      • Memory protection unit
    • Reset and supply management
      • Low-power, ultrasafe BOR (brownout reset) with 5 selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
    • Clock sources
      • 1 to 24 MHz crystal oscillator
      • 32 kHz oscillator for RTC with calibration
      • High Speed Internal 16 MHz factory-trimmed RC (+/- 1%)
      • Internal Low-power 37 kHz RC
      • Internal multispeed low-power 65 kHz to 4.2 MHz PLL for CPU clock and USB (48 MHz)
    • Pre-programmed bootloader
      • USB and USART supported
    • Development support
      • Serial wire debug supported
      • JTAG and trace supported
    • Up to 83 fast I/Os (70 I/Os 5V tolerant), all mappable on 16 external interrupt vectors
    • Memories
      • 256 Kbytes of Flash memory with ECC
      • 32 Kbytes of RAM
      • 8 Kbytes of true EEPROM with ECC
      • 128-byte backup register
    • LCD Driver (except STM32L151xC devices) up to 8x40 segments, contrast adjustment, blinking mode, step-up converter
    • Rich analog peripherals (down to 1.8 V)
      • 2x operational amplifiers
      • 12-bit ADC 1Msps up to 25 channels
      • 12-bit DAC 2 channels with output buffers
      • 2x ultra-low-power-comparators(window mode and wake up capability)
    • DMA controller 12x channels
    • 9x peripheral communication interfaces
      • 1x USB 2.0 (internal 48 MHz PLL)
      • 3x USARTs
      • Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
      • 2x I2Cs (SMBus/PMBus)
    • 11x timers: 1x 32-bit, 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window)
    • Up to 23 capacitive sensing channels
    • CRC calculation unit, 96-bit unique ID

Circuit Diagram

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity Services

      Active

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Cloud Sierra Wireless
      Enhanced Carrier Connectivity Services

      Description:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

      Active

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Cloud Sierra Wireless
      Global Smart Connectivity Services

      Description:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      Active

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      Cloud Sierra Wireless
      Octave Services

      Description:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity SIM

      Active

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Components and Modules Sierra Wireless
      Enhanced Carrier Connectivity SIM

      Description:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      Active

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Components and Modules Sierra Wireless
      Global Smart Connectivity SIM

      Description:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      Active

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      Components and Modules Sierra Wireless
      Octave Cellular Modules

      Description:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      RF Modules

      Active

      RF modules for Sub GigaHz and Bluetooth.

      Components and Modules DiZiC
      RF Modules

      Description:

      RF modules for Sub GigaHz and Bluetooth.

      SIGFOX-MOD1-C / -E

      Active

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      Components and Modules XoverIoT
      SIGFOX-MOD1-C / -E

      Description:

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.