STM32L162VD

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Ultra-low-power Arm Cortex-M3 MCU with 384 Kbytes of Flash memory, 32 MHz CPU, LCD, USB, 3xOp-amp, AES

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Product overview

Description

The ultra-low-power STM32L162xD devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance Arm® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 384 Kbytes and RAM up to 48 Kbytes), a flexible static memory controller (FSMC) interface (for devices with packages of 100 pins and more) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. The STM32L162xD devices offer three operational amplifiers, one 12-bit ADC, two DACs, two ultra-low-power comparators, AES, one general-purpose 32-bit timer, six general-purpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L162xD devices contain standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2S, one SDIO, three USARTs, two UARTs and an USB. The STM32L162xD devices offer up to 34 capacitive sensing channels to simply add a touch sensing functionality to any application.
They also include a real-time clock and a set of backup registers that remain powered in Standby mode.
Finally, the integrated LCD controller has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with the contrast independent of the supply voltage.
The ultra-low-power STM32L162xD devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to +105 °C temperature ranges. A comprehensive set of power-saving modes allows the design of low-power applications.
  • All features

    • Includes ST state-of-the-art patented technology
      • Ultra-low-power platform
        • 1.65 V to 3.6 V power supply
        • -40°C to 105°C temperature range
        • 305 nA Standby mode (3 wakeup pins)
        • 1.15 µA standby mode + RTC
        • 0.475 µA Stop mode (16 wakeup lines)
        • 1.35 µA Stop mode + RTC
        • 11 µA Low-power run mode
        • 230 µA/MHz Run mode
        • 10 nA ultra-low I/O leakage
        • 8 µs wakeup time
      • AES-128 bit encryption hardware accelerator
      • Core: Arm® Cortex®-M3 32-bit CPU
        • From 32 kHz up to 32 MHz max
        • 1.25 DMIPS/MHz (Dhrystone 2.1)
        • Memory protection unit
      • Reset and supply management
        • Low-power, ultrasafe BOR (brownout reset) with 5 selectable thresholds
        • Ultra-low-power POR/PDR
        • Programmable voltage detector (PVD)
      • Clock sources
        • 1 to 24 MHz crystal oscillator
        • 32 kHz oscillator for RTC with calibration
        • High speed internal 16 MHz factory-trimmed RC (+/- 1%)
        • Internal low power 37 kHz RC
        • Internal multispeed low power 65 kHz to 4.2 MHz
        • PLL for CPU clock and USB (48 MHz)
      • Pre-programmed bootloader
        • USB and USART supported
      • Development support
        • Serial wire debug supported
        • JTAG and trace supported
      • Up to 116 fast I/Os (102 I/Os 5V tolerant), all mappable on 16 external interrupt vectors
      • Memories
        • 384 Kbytes of Flash memory with ECC (with 2 banks of 192 Kbytes enabling Rww capability)
        • 48 Kbytes of RAM
        • 12 Kbytes of true EEPROM with ECC
        • 128-byte backup register
        • Memory interface controller supporting SRAM, PSRAM and NOR Flash
      • LCD driver for up to 8x40 segments
        • Support contrast adjustment
        • Support blinking mode
        • Step-up converter on board
      • Rich analog peripherals (down to 1.8V)
        • 3x operational amplifiers
        • 12-bit ADC 1 Msps up to 40 channels
        • 12-bit DAC 2 ch with output buffers
        • 2x ultra-low-power comparators(window mode and wakeup capability)
      • DMA controller 12x channels
      • 12x peripheral communication interfaces
        • 1x USB 2.0 (internal 48 MHz PLL)
        • 5x USARTs
        • Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
        • 2x I2Cs (SMBus/PMBus)
        • 1x SDIO interface
      • 11x timers: 1x 32-bit, 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window)
      • Up to 34 capacitive sensing channels
      • CRC calculation unit, 96-bit unique ID

Circuit Diagram

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity Services

      Active

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Cloud Sierra Wireless
      Enhanced Carrier Connectivity Services

      Description:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

      Active

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Cloud Sierra Wireless
      Global Smart Connectivity Services

      Description:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      Active

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      Cloud Sierra Wireless
      Octave Services

      Description:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity SIM

      Active

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Components and Modules Sierra Wireless
      Enhanced Carrier Connectivity SIM

      Description:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      Active

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Components and Modules Sierra Wireless
      Global Smart Connectivity SIM

      Description:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      Active

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      Components and Modules Sierra Wireless
      Octave Cellular Modules

      Description:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      RF Modules

      Active

      RF modules for Sub GigaHz and Bluetooth.

      Components and Modules DiZiC
      RF Modules

      Description:

      RF modules for Sub GigaHz and Bluetooth.

      SIGFOX-MOD1-C / -E

      Active

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      Components and Modules XoverIoT
      SIGFOX-MOD1-C / -E

      Description:

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.