STM32MP131C

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32-bit Arm Cortex-A7 650MHz MPU for Security

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Product overview

Key Benefits

Mainlined OpenSTLinux Distribution

One OpenSTLinux Software compatible with STM32MP1 Series. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.

Improved security with certifications

Target highly secured applications like POS, cash registers…

Highly energy efficient MPU

Best-In-Class in Low Power modes.

Description

The STM32MP131C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®­A9.

The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP131C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP131C/F devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.

All the devices offer one ADC, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG), and an advanced secured cryptographic acceleration cell. The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • All features

    • Includes ST state-of-the-art patented technology
    • Core
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 128-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16-bit
        • up to DDR3/DDR3L-1066 16-bit
      • 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
      • Dual Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
      • Temperature, voltage, frequency and 32 kHz monitoring
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop, LPLV-Stop, LPLV­Stop2 and Standby
      • DDR retention in Standby mode
      • Controls for PMIC companion chip
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 4 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 135 secure I/O ports with interrupt capability
      • Up to 6 wakeup
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 4 DMA controllers to unload the CPU
      • 56 physical channels in total
      • 1 x high-speed general-purpose master direct memory access controller (MDMA)
      • 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 26 communication peripherals
      • 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
      • 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI)
      • 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)(+2 QUADSPI + 4 with USART)
      • 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
      • 2 × USB 2.0 high-speed Host
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 1 x Ethernet MAC/GMAC
        • IEEE 1588v2 hardware, MII/RMII/RGMII
    • 6 analog peripherals
      • 1 × ADCs with 12-bit max. resolution up to 5 Msps
      • 1 x temperature sensor
      • 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
      • Internal or external ADC reference VREF+
    • Up to 24 timers and 2 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • Secure RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non­secure, virtual, hypervisor)
      • 2 × independent watchdogs
    • Hardware acceleration
      • AES 128, 192, 256 DES/TDES
      • AES 128, 256 with DPA protection
      • PKA ECC/RSA with DPA protection
      • AES 128 on-the-fly DRAM encryption and decryption
      • HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
      • 1 x true random number generator (6 triple oscillators)
      • 1 x CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
      • 4-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user and 256-bit HUK to protect AES 256 keys
    • All packages are ECOPACK2 compliant

Circuit Diagram

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP131CAE3
Active
LFBGA 289 14x14x1.7 P 0.8 mm Industrial Ecopack2
STM32MP131CAE3T
Active
LFBGA 289 14x14x1.7 P 0.8 mm Industrial Ecopack2
STM32MP131CAF3
Active
TFBGA 320 11x11x1.2 P 0.5 mm Industrial Ecopack2
STM32MP131CAG3
Active
TFBGA 289 9x9x1.2 P 0.5 mm Industrial Ecopack2
STM32MP131CAG3T
Active
TFBGA 289 9x9x1.2 P 0.5 mm Industrial Ecopack2

STM32MP131CAE3

Package:

LFBGA 289 14x14x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

LFBGA 289 14x14x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP131CAE3T

Package:

LFBGA 289 14x14x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

LFBGA 289 14x14x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP131CAF3

Package:

TFBGA 320 11x11x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 320 11x11x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP131CAG3

Package:

TFBGA 289 9x9x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 289 9x9x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP131CAG3T

Package:

TFBGA 289 9x9x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 289 9x9x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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STM32MP131CAE3 Active

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-
Package:
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Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32MP131CAE3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP131CAG3 Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32MP131CAG3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

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Distributor reported inventory date:

STM32MP131CAF3 Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32MP131CAF3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP131CAG3T Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32MP131CAG3T

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP131CAE3T Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32MP131CAE3T

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors