Product overview
Key Benefits
Dual Ethernet Ports
Addressing new applications and markets
LCD-TFT display controller
Includes a 24-bit parallel digital RGB controller and provides all signals to interface directly to a broad range of LCD and TFT panels |
Enhanced Camera pipe
Better performances with up to 5Mpix @ 15fps or 3Mpix @ 30fps
Description
The STM32MP135A/D devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®A9.
The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP135A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP135A/D devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG). The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
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All features
- Includes ST state-of-the-art patented technology
- Core
- 32-bit Arm® Cortex®-A7
- L1 32-Kbyte I / 32-Kbyte D
- 128-Kbyte unified level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-A7
- Memories
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16-bit
- up to DDR3/DDR3L-1066 16-bit
- 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
- Dual Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 1 Gbyte
- Security/safety
- TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
- Temperature, voltage, frequency and 32 kHz monitoring
- Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop, LPLV-Stop, LPLVStop2 and Standby
- DDR retention in Standby mode
- Controls for PMIC companion chip
- Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 4 × PLLs with fractional mode
- General-purpose input/outputs
- Up to 135 secure I/O ports with interrupt capability
- Up to 6 wakeup
- Interconnect matrix
- 2 bus matrices
- 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
- 2 bus matrices
- 4 DMA controllers to unload the CPU
- 56 physical channels in total
- 1 x high-speed general-purpose master direct memory access controller (MDMA)
- 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Up to 30 communication peripherals
- 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
- 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
- 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)
- 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with 4 inputs
- 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
- 2 × CAN controllers supporting CAN FD protocol
- 2 × USB 2.0 high-speed Host
- or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
- 2 x Ethernet MAC/GMAC
- IEEE 1588v2 hardware, MII/RMII/RGMII
- 8- to 16-bit camera interface, 3 Mpix @30 fps or 5Mpix @15 fps in color or monochrome with pixel clock @120 MHz (max freq)
- 6 analog peripherals
- 2 × ADCs with 12-bit max. resolution up to 5 Msps
- 1 x temperature sensor
- 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
- Internal or external ADC reference VREF+
- Graphics
- LCD-TFT controller, up to 24-bit // RGB888
- up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 x 1080) @ 30 fps
- pixel clock up to 90 MHz
- two layers (incl. 1 secured) with programmable color LUT
- LCD-TFT controller, up to 24-bit // RGB888
- Up to 24 timers and 2 watchdogs
- 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit advanced timers
- 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5 × 16-bit low-power timers
- Secure RTC with sub-second accuracy and hardware calendar
- 4 Cortex®-A7 system timers (secure, nonsecure, virtual, hypervisor)
- 2 × independent watchdogs
- Hardware acceleration
- ECDSA verification with SCA
- HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
- 1 x true random number generator (6 triple oscillators)
- 1 x CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
- 4-Kbyte embedded trace buffer
- 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user
- All packages are ECOPACK2 compliant
Circuit Diagram
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - STM32MP135D
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Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
HW Models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 08 Mar 2023 | 08 Mar 2023 |
IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 06 Mar 2023 | 06 Mar 2023 |
Board Manufacturing Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 7Z | 1.0 | 08 Mar 2023 | 08 Mar 2023 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32MP135DAE3 | Active | LFBGA 14X14 289L PITCH 0.8 MM | Industrial | Ecopack2 | |
| STM32MP135DAE7 | Active | LFBGA 14X14 289L PITCH 0.8 MM | Industrial | Ecopack2 | |
| STM32MP135DAF7 | Active | TFBGA 11X11 320L PITCH 0.5 MM | Industrial | Ecopack2 | |
| STM32MP135DAF7T | Active | TFBGA 11X11 320L PITCH 0.5 MM | Industrial | Ecopack2 | |
| STM32MP135DAF7U | Evaluation | TFBGA 11X11 320L PITCH 0.5 MM | Industrial | Ecopack2 | |
| STM32MP135DAG7 | Active | TFBGA 9X9 289L PITCH 0.5 MM | Industrial | Ecopack2 | |
STM32MP135DAE3
Package:
LFBGA 14X14 289L PITCH 0.8 MMMaterial Declaration**:
STM32MP135DAE7
Package:
LFBGA 14X14 289L PITCH 0.8 MMMaterial Declaration**:
STM32MP135DAG7
Package:
TFBGA 9X9 289L PITCH 0.5 MMMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | Junction Temperature (°C) (max) | Unit Price (US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||||
| STM32MP135DAF7U | distributors No availability of distributors reported, please contact our sales office | Evaluation | 3A991.a.2 | NEC | Tray | TFBGA 11X11 320L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | - | TAIWAN | ||
| STM32MP135DAE7 | distributors No availability of distributors reported, please contact our sales office | Active | 3A991.a.2 | NEC | Tray | LFBGA 14X14 289L PITCH 0.8 MM | - | - | -40 | 105 | TAIWAN | | 105 | 5.0469 | TAIWAN | ||
| STM32MP135DAF7T | distributors No availability of distributors reported, please contact our sales office | Active | 3A991.a.2 | NEC | Tape and Reel | TFBGA 11X11 320L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | 4.48 | TAIWAN | ||
| STM32MP135DAG7 | distributors No availability of distributors reported, please contact our sales office | Active | 3A991.a.2 | NEC | Tray | TFBGA 9X9 289L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | 4.2606 | TAIWAN | ||
| STM32MP135DAF7 | distributors No availability of distributors reported, please contact our sales office | Active | 3A991.a.2 | NEC | Tray | TFBGA 11X11 320L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | 4.48 | TAIWAN | ||
| STM32MP135DAE3 | distributors No availability of distributors reported, please contact our sales office | Active | 3A991.a.2 | NEC | Tray | LFBGA 14X14 289L PITCH 0.8 MM | - | - | -40 | 105 | TAIWAN | | 105 | - | TAIWAN | ||
STM32MP135DAF7U Evaluation
STM32MP135DAE7 Active
STM32MP135DAF7T Active
STM32MP135DAG7 Active
STM32MP135DAF7 Active
STM32MP135DAE3 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors