STM32MP135D

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Design Win

32-bit Arm Cortex-A7 1GHz MPU for Graphics

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Product overview

Key Benefits

Dual Ethernet Ports

Addressing new applications and markets

LCD-TFT display controller

Includes a 24-bit parallel digital RGB controller and provides all signals to interface directly to a broad range of LCD and TFT panels

Enhanced Camera pipe

Better performances with up to 5Mpix @ 15fps or 3Mpix @ 30fps​

Description

The STM32MP135A/D devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®­A9.

The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP135A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP135A/D devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG). The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • All features

    • Includes ST state-of-the-art patented technology
    • Core
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 128-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16-bit
        • up to DDR3/DDR3L-1066 16-bit
      • 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
      • Dual Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
      • Temperature, voltage, frequency and 32 kHz monitoring
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop, LPLV-Stop, LPLV­Stop2 and Standby
      • DDR retention in Standby mode
      • Controls for PMIC companion chip
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 4 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 135 secure I/O ports with interrupt capability
      • Up to 6 wakeup
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 4 DMA controllers to unload the CPU
      • 56 physical channels in total
      • 1 x high-speed general-purpose master direct memory access controller (MDMA)
      • 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 30 communication peripherals
      • 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
      • 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
      • 2 × CAN controllers supporting CAN FD protocol
      • 2 × USB 2.0 high-speed Host
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 2 x Ethernet MAC/GMAC
        • IEEE 1588v2 hardware, MII/RMII/RGMII
      • 8- to 16-bit camera interface, 3 Mpix @30 fps or 5Mpix @15 fps in color or monochrome with pixel clock @120 MHz (max freq)
    • 6 analog peripherals
      • 2 × ADCs with 12-bit max. resolution up to 5 Msps
      • 1 x temperature sensor
      • 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
      • Internal or external ADC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 x 1080) @ 30 fps
        • pixel clock up to 90 MHz
        • two layers (incl. 1 secured) with programmable color LUT
    • Up to 24 timers and 2 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • Secure RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non­secure, virtual, hypervisor)
      • 2 × independent watchdogs
    • Hardware acceleration
      • ECDSA verification with SCA
      • HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
      • 1 x true random number generator (6 triple oscillators)
      • 1 x CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
      • 4-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user
    • All packages are ECOPACK2 compliant

Circuit Diagram

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP135DAE3
Active
LFBGA 14X14 289L PITCH 0.8 MM Industrial Ecopack2
STM32MP135DAE7
Active
LFBGA 14X14 289L PITCH 0.8 MM Industrial Ecopack2
STM32MP135DAF7
Active
TFBGA 11X11 320L PITCH 0.5 MM Industrial Ecopack2
STM32MP135DAF7T
Active
TFBGA 11X11 320L PITCH 0.5 MM Industrial Ecopack2
STM32MP135DAF7U
Evaluation
TFBGA 11X11 320L PITCH 0.5 MM Industrial Ecopack2
STM32MP135DAG7
Active
TFBGA 9X9 289L PITCH 0.5 MM Industrial Ecopack2

STM32MP135DAE3

Package:

LFBGA 14X14 289L PITCH 0.8 MM

Material Declaration**:

Marketing Status

Active

Package

LFBGA 14X14 289L PITCH 0.8 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135DAE7

Package:

LFBGA 14X14 289L PITCH 0.8 MM

Material Declaration**:

Marketing Status

Active

Package

LFBGA 14X14 289L PITCH 0.8 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135DAF7

Package:

TFBGA 11X11 320L PITCH 0.5 MM

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 11X11 320L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135DAF7T

Package:

TFBGA 11X11 320L PITCH 0.5 MM

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 11X11 320L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135DAF7U

Package:

TFBGA 11X11 320L PITCH 0.5 MM

Material Declaration**:

PDF XML

Marketing Status

Evaluation

Package

TFBGA 11X11 320L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135DAG7

Package:

TFBGA 9X9 289L PITCH 0.5 MM

Material Declaration**:

Marketing Status

Active

Package

TFBGA 9X9 289L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
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Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Junction Temperature (°C) (min)
Budgetary Price (US$)*/Qty
Junction Temperature (°C) (max)
Unit Price (US$)
Country of Origin
min
max
STM32MP135DAF7U Available at distributors

Distributor availability of STM32MP135DAF7U

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Evaluation
3A991.a.2 NEC Tray TFBGA 11X11 320L PITCH 0.5 MM - - -40

105

-

TAIWAN

STM32MP135DAE7 Available at distributors

Distributor availability of STM32MP135DAE7

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
3A991.a.2 NEC Tray LFBGA 14X14 289L PITCH 0.8 MM - - -40

105

5.0469

TAIWAN

STM32MP135DAF7T Available at distributors

Distributor availability of STM32MP135DAF7T

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
3A991.a.2 NEC Tape and Reel TFBGA 11X11 320L PITCH 0.5 MM - - -40

105

4.48

TAIWAN

STM32MP135DAG7 Available at distributors

Distributor availability of STM32MP135DAG7

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
3A991.a.2 NEC Tray TFBGA 9X9 289L PITCH 0.5 MM - - -40

105

4.2606

TAIWAN

STM32MP135DAF7 Available at distributors

Distributor availability of STM32MP135DAF7

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
3A991.a.2 NEC Tray TFBGA 11X11 320L PITCH 0.5 MM - - -40

105

4.48

TAIWAN

STM32MP135DAE3 Available at distributors

Distributor availability of STM32MP135DAE3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
3A991.a.2 NEC Tray LFBGA 14X14 289L PITCH 0.8 MM - - -40

105

-

TAIWAN

STM32MP135DAF7U Evaluation

Package:
TFBGA 11X11 320L PITCH 0.5 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAF7U

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

STM32MP135DAE7 Active

Package:
LFBGA 14X14 289L PITCH 0.8 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAE7

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

Distributor Name

Distributor reported inventory date:

STM32MP135DAF7T Active

Package:
TFBGA 11X11 320L PITCH 0.5 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAF7T

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

STM32MP135DAG7 Active

Package:
TFBGA 9X9 289L PITCH 0.5 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAG7

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

Distributor Name

Distributor reported inventory date:

STM32MP135DAF7 Active

Package:
TFBGA 11X11 320L PITCH 0.5 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAF7

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

Distributor Name

Distributor reported inventory date:

STM32MP135DAE3 Active

Package:
LFBGA 14X14 289L PITCH 0.8 MM
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STM32MP135DAE3

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors