Product overview
Description
This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high power density in order to meet the higest efficiency requirements.
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All features
- ACEPACK 1 power module:
- DBC Cu-Al2O3-Cu based
- Insulation voltage UL certified of 2.5 kVrms
- Press-fit contact pins
- Fourpack topology:
- 1200 V SiC MOSFET
- RDS(on) typical 25 mΩ
- Very high-power density
- Very low switching energies
- Switching characteristic almost independent from temperature
- Integrated NTC temperature sensor
- ACEPACK 1 power module:
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