A1F25M12W2-F1

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ACEPACK 1 power module, fourpack topology, 1200 V, 25 mOhm typ. SiC MOSFET gen.2 with NTC

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Product overview

Description

This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high power density in order to meet the higest efficiency requirements.

  • All features

    • ACEPACK 1 power module:
      • DBC Cu-Al2O3-Cu based
      • Insulation voltage UL certified of 2.5 kVrms
      • Press-fit contact pins
    • Fourpack topology:
      • 1200 V SiC MOSFET
      • RDS(on) typical 25 mΩ
      • Very high-power density
      • Very low switching energies
      • Switching characteristic almost independent from temperature
    • Integrated NTC temperature sensor

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STMicroelectronics - A1F25M12W2-F1

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
A1F25M12W2-F1
Active
ACEPACK 1 Industrial Ecopack1

A1F25M12W2-F1

Package:

ACEPACK 1

Material Declaration**:

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Marketing Status

Active

Package

ACEPACK 1

Grade

Industrial

RoHS Compliance Grade

Ecopack1

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors