SH32N65DM6AG

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Design Win

Automotive-grade N-channel 650 V, 89 mOhm typ., 32 A MDmesh DM6 half-bridge topology Power MOSFET in an ACEPACK SMIT package

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Product overview

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.

  • All features

    • AQG 324 qualified
    • Half-bridge power module
    • 650 V blocking voltage
    • Fast recovery body diode
    • Very low switching energies
    • Low package inductance
    • Dice on direct bond copper (DBC) substrate
    • Low thermal resistance
    • Isolation rating of 3.4 kVrms/min

EDA Symbols, Footprints and 3D Models

STMicroelectronics - SH32N65DM6AG

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SH32N65DM6AG
Active
ACEPACK SMIT Automotive Ecopack2

SH32N65DM6AG

Package:

ACEPACK SMIT

Material Declaration**:

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Marketing Status

Active

Package

ACEPACK SMIT

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors