Product overview
Description
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
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All features
- AQG 324 qualified
- Half-bridge power module
- 650 V blocking voltage
- Fast recovery body diode
- Very low switching energies
- Low package inductance
- Dice on direct bond copper (DBC) substrate
- Low thermal resistance
- Isolation rating of 3.4 kVrms/min
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All tools & software
All resources
Resource title | Version | Latest update |
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Product Specifications (1)
Resource title | Version | Latest update | ||
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2.0 | 04 Oct 2022 | 04 Oct 2022 |
Application Notes (5)
Resource title | Version | Latest update | ||
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1.1 | 13 Sep 2018 | 13 Sep 2018 | ||
2.0 | 10 May 2023 | 10 May 2023 | ||
1.4 | 13 Sep 2018 | 13 Sep 2018 | ||
1.3 | 13 Sep 2018 | 13 Sep 2018 | ||
1.1 | 13 Sep 2018 | 13 Sep 2018 |
Technical Notes & Articles (4)
Resource title | Version | Latest update | ||
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1.0 | 19 Nov 2021 | 19 Nov 2021 | ||
1.0 | 13 Nov 2016 | 13 Nov 2016 | ||
2.4 | 11 Jul 2023 | 11 Jul 2023 | ||
1.1 | 11 Jul 2023 | 11 Jul 2023 |
User Manuals (1)
Resource title | Version | Latest update | ||
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1.3 | 21 Oct 2016 | 21 Oct 2016 |
Flyers (5 of 10)
Resource title | Version | Latest update | ||
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1.0 | 22 May 2023 | 22 May 2023 | ||
1.0 | 13 Apr 2023 | 13 Apr 2023 | ||
1.0 | 15 Sep 2021 | 15 Sep 2021 | ||
1.1 | 13 Apr 2023 | 13 Apr 2023 | ||
1.0 | 06 May 2022 | 06 May 2022 | ||
1.0 | 27 Feb 2022 | 27 Feb 2022 | ||
1.0 | 06 May 2022 | 06 May 2022 | ||
1.0 | 08 May 2020 | 08 May 2020 | ||
1.0 | 19 Nov 2021 | 19 Nov 2021 | ||
1.0 | 06 Oct 2020 | 06 Oct 2020 |
Brochures (3)
Resource title | Version | Latest update | ||
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1.0 | 28 Apr 2022 | 28 Apr 2022 | ||
1.0 | 24 Jul 2020 | 24 Jul 2020 | ||
1.0 | 12 Oct 2021 | 12 Oct 2021 |
EDA Symbols, Footprints and 3D Models
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|---|
SH32N65DM6AG | Active | ACEPACK SMIT | Automotive | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
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min | max | |||||||||||
SH32N65DM6AG | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape and Reel | ACEPACK SMIT | - | - | PHILIPPINES | |
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors