SH70M12W3AG
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Design Win
Automotive-grade ACEPACK SMIT half-bridge topology featuring 1200 V, 67 mOhm typ., 28 A SiC Power MOSFET

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Product overview

Description

The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.

The SiC MOSFETs inside provide outstanding features, like very low on-resistance, fast switching, reduced parasitic, and robust body diode. The half-bridge association can be used to build several topologies: totem pole PFC, full, and B6 bridges.

  • All features

    • AQG 324 qualified
    • Half-bridge topology SiC MOSFET module
    • 1200 V rated voltage
    • Dice on direct bond copper (DBC) substrate
    • SMD with insulated top side cooling
    • Isolation voltage of 3.4 kVrms
    • Low thermal resistance
    • Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)

eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

Signal Conditioning Design Tool

NFC/RFID Calculators

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Power Management Design Center

Power Supply Design Tool

• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type:
DC/DC
AC/DC
Solar Battery Charger

Power Management Design Center

LED Lighting Design Tool

• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type:
DC/DC
AC/DC

Power Management Design Center

Digital Power Workbench

• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs

Power Management Design Center

Power Tree Designer

• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
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Thermal-electrical Simulators for Components

STPOWER Studio

• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties

Thermal-electrical Simulators for Components

PCB Thermal Simulator

• Thermal analysis of a PCB from Gerber files.
• Possibility to add heat sources, heat sinks, copper areas and thermal paths.
• Powerful server-side engine for rendering and simulation.
• Thermal results shown graphically via 2D table.

Thermal-electrical Simulators for Components

AC Switches Simulator

• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices

Thermal-electrical Simulators for Components

Rectifier Diodes Simulator

• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices

Thermal-electrical Simulators for Components

Twister Sim

• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations

Thermal-electrical Simulators for Components

TVS Simulator

• Specify system ratings and surge waveform
• Search and sort suitable devices

Thermal-electrical Simulators for Components

Estimate

• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
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Signal Conditioning Design Tool

Active Filters

• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass

Signal Conditioning Design Tool

Comparators

• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window

Signal Conditioning Design Tool

Low side Current Sensing

• Returns circuit component values
• Provides current error graphs

Signal Conditioning Design Tool

High side Current Sensing

• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
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NFC/RFID Calculators

NFC Inductance

• Input geometry and substrate properties
• Get antenna impedance

NFC/RFID Calculators

UHF Link Budget

• Enter forward and reverse link characteristics
• The tool returns link budget estimate

NFC/RFID Calculators

NFC Tuning Circuit

• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets

EDA Symbols, Footprints and 3D Models

STMicroelectronics - SH70M12W3AG

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
SH70M12W3AG
Active
ACEPACK SMIT Automotive Ecopack2 - -

SH70M12W3AG

Package:

ACEPACK SMIT

Material Declaration**:

PDF XML

Marketing Status

Active

Package

ACEPACK SMIT

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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