Product overview
Description
This device combines two IGBTs and diodes in half-bridge topology mounted on a very compact and rugged easily surface-mounted package. The device is part of the HB series IGBTs, which is optimized both in conduction and switching losses for soft commutation. A freewheeling diode with a low drop forward voltage is included in every switch. The result is a product specifically designed to maximize efficiency for any resonant and soft-switching applications.
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All features
- AQG 324 qualified
- High-speed switching series
- Maximum junction temperature: TJ = 175 °C
- Low VCE(sat) = 1.6 V (typ.) @ IC = 65 A
- Minimized tail current
- Tight parameter distribution
- Low thermal resistance thanks to DBC substrate
- Positive temperature VCE(sat) coefficient
- Soft and very fast recovery antiparallel diode
All tools & software
All resources
| Resource title | Version | Latest update |
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Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 15 Nov 2022 | 15 Nov 2022 |
Application Notes (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 05 Dec 2022 | 05 Dec 2022 | ||
| 1.1 | 18 Jul 2022 | 18 Jul 2022 | ||
| 1.0 | 30 Jan 2019 | 30 Jan 2019 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Nov 2021 | 19 Nov 2021 |
Flyers (4)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 07 Jul 2020 | 07 Jul 2020 | ||
| 1.0 | 27 Jan 2023 | 27 Jan 2023 | ||
| 1.0 | 13 Nov 2020 | 13 Nov 2020 | ||
| 1.0 | 04 May 2020 | 04 May 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STGSH80HB65DAG
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | General Description | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|---|
| STGSH80HB65DAG | Active | Automotive-grade ACEPACK SMIT half-bridge topology 650 V, 80 A HB series IGBT with diode | ACEPACK SMIT | Automotive | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | General Description | Budgetary Price (US$)*/Qty | Country of Origin | General Description | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||
| STGSH80HB65DAG | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape and Reel | ACEPACK SMIT | - | - | PHILIPPINES | Automotive-grade ACEPACK SMIT half-bridge topology 650 V, 80 A HB series IGBT with diode | | PHILIPPINES | Automotive-grade ACEPACK SMIT half-bridge topology 650 V, 80 A HB series IGBT with diode | ||
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors