ST offers a comprehensive portfolio of IGBTs (Insulated Gate Bipolar Transistors) ranging from 300 to 1700 V, both in planar punch-through (PT) and trench-gate field-stop (TFS) technologies. IGBTs belong to the STPOWER family.
Offering an optimal trade-off between switching performance and on-state behavior (variant), ST's IGBTs are suitable for industrial and automotive segments in applications such as general-purpose inverters, motor control, home appliances, HVAC, UPS/SMPS, welding equipment, induction heating, solar inverters, traction inverters, on-board chargers & fast chargers.
Our IGBTs are available in bare die as well as packaged discrete components.
STPOWER IGBT main characteristics:
- Best trade-off between conduction and switch-off energy losses
- Maximum junction temperature up to 175 °C
- Wide switching frequency range
- Co-packaged anti-parallel diode option for improved power dissipation and optimal thermal management
Our wide STPOWER product portfolio combined with state-of-the art packaging and protections for high reliability and safety helps designers find the right solutions for customized, high-efficiency applications that will last a long lifetime.
STMicroelectronics presents ACEPACK SMIT: a surface-mount power module with top-side cooling, which ensures higher power density and improved thermal management for very efficient and more compact systems.