Product overview
Description
The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.
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All features
- EMI symmetrical (I/O) low-pass filter
- High efficiency in EMI filtering
- Very low PCB space consuming:1.07 mm x 1.47 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppression
- High reliability offered by monolithic integration
- High reducing of parasitic elements through integration and wafer level packaging
- Complies with the following standards:
- IEC 61000-4-2 level 4, on input pins
- 15 kV (air discharge)
- 8 kV (contact discharge)
- IEC 61000-4-2 Level 1, on output pins
- 2 kV (air discharge)
- 2 kV (contact discharge)
- MIL STD 883E - Method 3015-6 Class 3
- IEC 61000-4-2 level 4, on input pins
EDA Symbols, Footprints and 3D Models
The STMicroelectronics team - EMIF02-MIC03F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 10 Jun 2021 | 10 Jun 2021 | ||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |