Product overview
Description
The HSP061-4M10 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes the device compatible with 3.4 Gbps.
The device is packaged in μQFN-10L 2.5 x 1 mm with a 500 μm pitch, which minimizes the PCB area.
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All features
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 8.7 GHz
- Ultralow capacitance: 0.3 pF
- Low leakage current: 70 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- Thin package: 0.5 mm max.
- RoHS compliant
- Benefits
- High ESD robustness of the equipment
- Suitable for high density boards
- Complies with following standards
- MIL-STD 883G Method 3015-7 Class 3B:
- 8 kV
- IEC 61000-4-2 level 4:
- 8 kV (contact discharge)
- 15 kV (air discharge)
- MIL-STD 883G Method 3015-7 Class 3B:
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP061-4M10
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All resources
| Resource title | Version | Latest update |
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SPICE models (1)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 07 Jul 2020 | 07 Jul 2020 |
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 02 Apr 2021 | 02 Apr 2021 | ||
| ZIP | 1.0 | 17 Mar 2020 | 17 Mar 2020 |