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Key Features
- Hardware features
- Arm® Cortex®-M3 32-bit RISC core
- 12 Kbytes of user RAM
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512 Kbytes of user Flash memory with a one-time programmable (OTP) area
- 10-year data retention at 105 °C, or 15 years at 85 °C
- 500Â 000 Erase/Write cycles per page
- 50 million Erase/Write cycles per 64 Kbyte sector
- Page granularity of 128 bytes
- Block granularity: 1 Kbyte
- 128 bytes of user OTP area
- Page Erase time 4Â ms
- Block Erase (1 Kbyte) in 20Â ms
- Programming performance up to 10 μs/byte
- Flash memory Erase/Write protection software programmable on 64-Kbyte sectors
- Asynchronous receiver transmitter supporting ISO 7816-3 T=0 and T=1 protocols
- Two 16-bit timers with interrupt capability
- 1.8Â V, 3Â V and 5Â V supply voltage ranges
- External clock frequency from 1Â MHz up to 7.5Â MHz
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High performance provided by:
- CPU clock frequency up to 15Â MHz
- External clock multiplier (2x, 3x, and 4x)
- Current consumption compatible with the GSM (global system for mobile communications) and ETSI (European telecommunications standards institute) specifications
- Power-saving Standby state
- Contact assignment compatible with ISOÂ 7816-2
- Electrostatic disturbance (ESD) protection greater than 4Â kV (human body model)
- 8-pin DFN (5 × 6 mm) ECOPACK package
- Security features
- Monitoring of environmental parameters
- Protection against faults
- ISOÂ 3309 cyclic redundancy check (CRC) calculation block
- True random number generator
- Unique serial number on each die
- Hardware data encryption standard (DES) accelerator
- Software features
- Flash memory loader
- Flash memory drivers
- Development environment
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Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation:
- C compiler
- Simulator
- Emulator
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Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation:
- Hardware features
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Sep 2020 |
25 Sep 2020
|
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Jul 2020 |
17 Jul 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST32F512M
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| ST32F512M |
Active
|
DICE | Industrial | N/A |
|
ST32F512M
Package:
DICEMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| ST32F512M | No availability of distributors reported, please contact our sales office |
Active
|
5A002A1 | 5A002A1 | Not Applicable | DICE | -40 | 105 | FRANCE | |||
Marketing Status
ActiveECCN (US)
5A002A1(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors
