Design Win

In-vehicle Secure Element based on JavaCard™ Open Platform & other use cases

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Product overview


The STSAFE-V500 system on chip is a top-class embedded secure element (eSE) able to manage Java® Card applets from different stakeholders (such as the user, original equipment manufacturer (OEM), hardware integrator, or service provider).

The STSAFE-V500 is providing a full range of solutions according to different use cases detailed in this document such as:

StrongBox (SB) In vehicle CCC digital key (DK) Qi charging (Qi) Open Java ® Card platform (JC)

Each solution is identified as a standalone turn key solution (no dynamic switch possible between the different solutions).

It also proposes an open Java® Card pen platform capable of loading any third-party Java® Card applet.

Both a turn key solution and an Open Java® Card platform solution offer a common backbone to ease final user integration; this document describes the common set of features (the common backbone) and highlights also specific features relevant for each turn key solution.

The device is compliant with Java® Card 3.0.5 with enhanced mechanisms of memory management, security, and data management.

It also supports the GlobalPlatform® Card Specifications v.2.3 and related amendments:

GlobalPlatform ® amendment C – Contactless services v1.3 (support of the "cumulative delete" and "get status" sections) GlobalPlatform ® amendment D – Secure channel protocol SCP03 v1.1.1 GlobalPlatform ® amendment F – Secure channel protocol ‘11’ v1.2.1 GlobalPlatform ® amendment H – Executable load file upgrade v1.1 GlobalPlatform ® access control v1.1 GlobalPlatform ® APDU communication over I²C/SPI based on the GlobalPlatform ® “APDU transport over I2C/SPI” specification v1.0 GlobalPlatform ® SE configuration v2.0

The STSAFE-V500 is integrated with Android™ applications Keymint and Weaver. It can also host STMicroelectronics applications for secure storage.

It supports multiple logical secure elements that allow multiple Android™ Linux® virtual machines executing on a hypervisor environment accessing Java® Card applications.

It provides state-of-the-art security for the provided functionality, resistant to recent EMVCo/JIL hardware-related attacks subgroup (JHAS) identified vulnerabilities; it ensures a high level of security and isolation between applications, and Common Criteria EAL5+ certification is ongoing (specific for SB).

  • All features

    • Hardware features
      • AEC-Q100 grade 2
      • Arm® Cortex®-M35P 32-bit RISC core cadenced at 63 MHz
      • Operating temperature range: −40 °C to 105 °C
      • High-stress memory:
        • Endurance of 500 000 erase/write cycles (without hardware wear leveling)
        • Configured to enhance specific objects endurance: up to 10 million write cycles with a total of 1 gigabyte of updated dataSoftware wear leveling capability for cycling extension and specific cases
        • 20 years data retention
      • Available in a TSSOP20 and UFQFPN32 wettable flank package
      • External interfaces:
        • ISO/IEC7816-3 (ST Reserved test feature)
        • Slave serial peripheral interface (SPI) up to 10 MHz
        • Slave I²C interface up to 1 Mb/s
      • Class C (1.8 V), Class B (3 V) and 3.3 V supply voltage ranges
      • ESD protection greater than 4 kV (HBM)
      • CC EAL 6+ certified
    • Software features
      • Java® Card 3.0.5 classic operating system
      • GlobalPlatform® 2.3 support
      • Support for GlobalPlatform® SCP03 and SCP11
      • Support for GlobalPlatform® ELF upgrade
      • Android Ready SE Alliance secure element
      • Dynamic memory management
      • APDU communication over I²C/SPI based on the GlobalPlatform® APDU Transport over I2C/SPI specification
      • Firmware upgrade mechanism
      • Support of multiple logical secure element for hypervisor support
      • In certification CC EAL5+ according to Java® Card open protection profile
      • Proprietary Java® Card API for key derivation function (KDF)
      • Proprietary Java® Card API for elliptic curves operations

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STSAFE-V500

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
TSSOP-20 Automotive N/A




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(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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STSAFE-V500 Evaluation

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors