Product overview
Description
The C65SPACE is fabricated on a proprietary 65nm, 7 metal layers CMOS process intended for use with a core voltage of 1.2V ±0.10V.The ST standard-cells, memories and PLL have been designed and characterized to be compatible with each other.
-
All features
- Process
- STMicroelectronics C65SPACE (65nm CMOS)
- 3.3V IO gate oxide GO2 (5nm)
- 1.2V core gate oxide GO1 (1.8nm), triple VT transistors
- 7 copper metallization,5 thin and 2 thick
- Low-K inter-metallic dielectrics for thin metal layers
- High density SRAMs
- Compatible with flip-chip and wire bonding packaging
- Radiations
- SEL-free up to LET = 60Mev/mg/cm2 at 125°C Tj and Vdd max
- SEE hardened library
- Tested up to a total dose of 300 krads (Si)
- Reliability
- Library cells models with 20 years aging
- Transistor models including aging alteration
- ESD better than:
- 2kV in HBM (Class 2 / MIL-STD-883H)
- 150V in MM
- 250V in CDM
- Library offer
- Comprehensive library of standard logic with PVT and aging corners models
- IO pad libraries provide interfaces at 3.3V +/-0.30V, 2.5V+/-0.25V and 1.8V +/-0.15V
- High speed IO Pad LVDS supplied at 2.5V +/-0.25V up to 650Mbps
- Cold sparing IOs with single/double row support
- Memories generation: single port SRAM, ROM, Dual port SRAMs, BIST library, EDAC library
- Wide-range PLLs 1.2GHz with multi-phase outputs
- 6.25Gbit/s high speed serial links (HSSL)
- Design flow
- An ST customized design flow (RTL to GDS) invoking commercial solutions (Synopsys, Cadence, Mentor…) is available for partners and certified design houses:
- Front-End kit from RTL to gates based
- SiPKit for IO ring generation
- FFKit for place and route
- SignOffKit for final verification before tape-out
- For customer owned tools (COT) flow, ST provides the C65SPACE design platform along with the DRM and sign-off kit.
- An ST customized design flow (RTL to GDS) invoking commercial solutions (Synopsys, Cadence, Mentor…) is available for partners and certified design houses:
- Process