ST offers a portfolio of MEMS automotive sensors qualified according to AEC-Q100. Our automotive sensor portfolio includes digital accelerometers with low and high g full scale, and digital 3-axis gyroscopes.

ST’s low g 3-axis accelerometers have advanced power-saving features and an extended temperature range that make them the ideal choice for non-critical automotive applications including telematics, navigation, infotainment and security. Our high g acceleration sensors feature an extended temperature range and are suitable for airbag applications in vehicle safety restraint systems.

Our 3-axis gyroscopes offer superior stability over time and temperature, and guarantee the level of accuracy required by the most advanced navigation systems embedding dead reckoning. ST’s 3-axis gyroscopes have a single sensing structure for motion measurement along all three orthogonal axes, while other solutions on the market rely on two or three independent structures. Our solution eliminates any interference between the axes that inherently degrades the output signal. The result is increased accuracy and reliability of motion-controlled functionalities.

ST’s MEMS automotive sensors are developed on the same technology platform used for high-volume MEMS at the core of many industrial and consumer applications.

Teseo Draw enables 3D navigation

New firmware fuses satellite data with vehicle-sensor data for advanced 3D navigation

TESEO DRAW sensor fusion firmware merges the satellite information with data from vehicle sensors such as the gyroscope, accelerometer, and wheel-speed sensors, to calculate location accurately in three dimensions including elevation. If the satellite signal is poor, TESEO DRAW compensates for the loss of accuracy, and if the signal becomes unavailable, navigation continues uninterrupted based on calculated location (dead reckoning).

With the new Teseo DRAW firmware, ST provides a unified platform comprising navigation engines, 3D positioning capability, and motion sensors. The firmware is loaded on Teseo III multi-constellation receivers.

New MEMS accelerometers for airbag central unit (ACU) complete ST’s airbag kit

STMicroelectronics has introduced two central airbag crash sensors alongside its peripheral crash sensors, airbag system ICs, and safety microcontrollers, creating a complete airbag-electronics kit that supports functional-safety requirements.

The AIS1120SX and AIS2120SX single- and dual-axis 120g in-plane MEMS accelerometers are designed to be mounted in the vehicle’s Airbag Control Unit (ACU) responsible for evaluating the sensor data and triggering the appropriate restraint system.

The sensors interact with an airbag system IC and a safety microcontroller, which coordinate airbag activation.

A choice of three airbag system ICs, the L9678P, L9679P, and L9680 meet the demands of applications ranging from entry or mid-level to high-end vehicles with multiple airbag firing loops. Click here for further information about airbag system ICs.

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